Pattern Transfer using Step&Stamp Imprint Lithography

Tomi Haatainen (Corresponding Author), Jouni Ahopelto

Research output: Contribution to journalArticleScientificpeer-review

21 Citations (Scopus)

Abstract

Industrially efficient lithography process requires high throughput production, wafer scale patterning capable of handling wafers up to 8 inches. Nanoimprint lithography is a new candidate for patterning below 100 nm range. There are two methods to do large area imprinting: Wafer size parallel imprinting or sequential imprinting, mimicking the operation of an optical stepper. The step&stamp imprint lithography is a sequential printing method developed for patterning large areas using a small patterned stamp. A commercial flip chip bonder is used to demonstrate the process. A small silicon stamp with size of 3 × 3 mm2 was used as a mold to create test patterns on a silicon wafer. The stamp was patterned using optical lithography and dry etching, and contained test structures of 5 µm grid patterns. New thermoplastic polymers mr-I 8000, developed for imprint lithography, were used in the experiments.
Original languageEnglish
Pages (from-to)357-360
Number of pages4
JournalPhysica Scripta
Volume67
Issue number4
DOIs
Publication statusPublished - 2003
MoE publication typeA1 Journal article-refereed

Fingerprint

Lithography
Wafer
Patterning
lithography
wafers
Silicon
Flip chip
Nanoimprint Lithography
Optical Lithography
Etching
High Throughput
silicon
Polymers
printing
Grid
chips
grids
etching
Range of data
Demonstrate

Cite this

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title = "Pattern Transfer using Step&Stamp Imprint Lithography",
abstract = "Industrially efficient lithography process requires high throughput production, wafer scale patterning capable of handling wafers up to 8 inches. Nanoimprint lithography is a new candidate for patterning below 100 nm range. There are two methods to do large area imprinting: Wafer size parallel imprinting or sequential imprinting, mimicking the operation of an optical stepper. The step&stamp imprint lithography is a sequential printing method developed for patterning large areas using a small patterned stamp. A commercial flip chip bonder is used to demonstrate the process. A small silicon stamp with size of 3 × 3 mm2 was used as a mold to create test patterns on a silicon wafer. The stamp was patterned using optical lithography and dry etching, and contained test structures of 5 µm grid patterns. New thermoplastic polymers mr-I 8000, developed for imprint lithography, were used in the experiments.",
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Pattern Transfer using Step&Stamp Imprint Lithography. / Haatainen, Tomi (Corresponding Author); Ahopelto, Jouni.

In: Physica Scripta, Vol. 67, No. 4, 2003, p. 357-360.

Research output: Contribution to journalArticleScientificpeer-review

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AU - Ahopelto, Jouni

PY - 2003

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AB - Industrially efficient lithography process requires high throughput production, wafer scale patterning capable of handling wafers up to 8 inches. Nanoimprint lithography is a new candidate for patterning below 100 nm range. There are two methods to do large area imprinting: Wafer size parallel imprinting or sequential imprinting, mimicking the operation of an optical stepper. The step&stamp imprint lithography is a sequential printing method developed for patterning large areas using a small patterned stamp. A commercial flip chip bonder is used to demonstrate the process. A small silicon stamp with size of 3 × 3 mm2 was used as a mold to create test patterns on a silicon wafer. The stamp was patterned using optical lithography and dry etching, and contained test structures of 5 µm grid patterns. New thermoplastic polymers mr-I 8000, developed for imprint lithography, were used in the experiments.

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