Abstract
Due to new fabrication technologies, conductor widths and other dimensions of PC boards have been further reduced and the need for automated visual inspections becomes even more important. The objective of this work is to evaluate the existing methods and systems in order to see how they meet the changing requirements of fabrication technology. The algorithms, which seemed to be most promising, are tested by computer simulations and the good and weak points of the methods are discussed. Finally, a new method under investigation is described briefly.
| Original language | English |
|---|---|
| Title of host publication | 7th International Conference on Pattern Recognition |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Pages | 1355-1357 |
| Volume | 2 |
| ISBN (Print) | 978-0-8186-0545-1 |
| Publication status | Published - 1984 |
| MoE publication type | A4 Article in a conference publication |
| Event | 7th International Conference on Pattern Recognition - Montreal, Canada Duration: 30 Jul 1984 → 2 Aug 1984 |
Conference
| Conference | 7th International Conference on Pattern Recognition |
|---|---|
| Country/Territory | Canada |
| City | Montreal |
| Period | 30/07/84 → 2/08/84 |