Performance of fiber based ESD protective packaging

Jaakko Paasi, Riku Vuorinen, Pekka Maijala, Helge Palmen, Veijo Salminen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Abstract

    We have studied the performance (surface resistance, charge decay and electrostatic discharge shielding properties) of 100 % recyclable, biodegradable, fiber based ESD protective packages and packaging materials. The measurements have been done in the humidity range of 5 - 95 % RH, representing extreme environmental conditions experienced by electronic products during global transportation and storage. The tested fiber based materials seem very promising for the new generation of ESD protective packaging. They can shield ESD sensitive electronics from external ESD contact discharges of several kV magnitude and effectively dissipate or migrate electric charge.
    Original languageEnglish
    Title of host publicationElectrical Overstress/Electrostatic Discharge Symposium Proceedings 2001
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages50-54
    ISBN (Print)978-1-5853-7039-9
    Publication statusPublished - 2001
    MoE publication typeB3 Non-refereed article in conference proceedings
    Event2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23 - Portland, United States
    Duration: 9 Sep 200113 Sep 2001

    Conference

    Conference2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23
    CountryUnited States
    CityPortland
    Period9/09/0113/09/01

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  • Cite this

    Paasi, J., Vuorinen, R., Maijala, P., Palmen, H., & Salminen, V. (2001). Performance of fiber based ESD protective packaging. In Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2001 (pp. 50-54). IEEE Institute of Electrical and Electronic Engineers. https://ieeexplore.ieee.org/document/5254989