Performance of fiber based ESD protective packaging

Jaakko Paasi; Riku Vuorinen; Pekka Maijala; Helge Palmen; Veijo Salminen

Performance of fiber based ESD protective packaging

Jaakko Paasi, Riku Vuorinen, Pekka Maijala, Helge Palmen, Veijo Salminen

Nokia Oyj

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Abstract

We have studied the performance (surface resistance, charge decay and electrostatic discharge shielding properties) of 100 % recyclable, biodegradable, fiber based ESD protective packages and packaging materials. The measurements have been done in the humidity range of 5 - 95 % RH, representing extreme environmental conditions experienced by electronic products during global transportation and storage. The tested fiber based materials seem very promising for the new generation of ESD protective packaging. They can shield ESD sensitive electronics from external ESD contact discharges of several kV magnitude and effectively dissipate or migrate electric charge.

Original language	English
Title of host publication	Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2001
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	50-54
ISBN (Print)	978-1-5853-7039-9
Publication status	Published - 2001
MoE publication type	B3 Non-refereed article in conference proceedings
Event	2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23 - Portland, United States Duration: 9 Sept 2001 → 13 Sept 2001

Conference

Conference	2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23
Country/Territory	United States
City	Portland
Period	9/09/01 → 13/09/01

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Cite this

@inproceedings{40ba2bdb46e344a7bcb07ae607e8d7ec,

title = "Performance of fiber based ESD protective packaging",

abstract = "We have studied the performance (surface resistance, charge decay and electrostatic discharge shielding properties) of 100 % recyclable, biodegradable, fiber based ESD protective packages and packaging materials. The measurements have been done in the humidity range of 5 - 95 % RH, representing extreme environmental conditions experienced by electronic products during global transportation and storage. The tested fiber based materials seem very promising for the new generation of ESD protective packaging. They can shield ESD sensitive electronics from external ESD contact discharges of several kV magnitude and effectively dissipate or migrate electric charge.",

author = "Jaakko Paasi and Riku Vuorinen and Pekka Maijala and Helge Palmen and Veijo Salminen",

year = "2001",

language = "English",

isbn = "978-1-5853-7039-9",

pages = "50--54",

booktitle = "Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2001",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23 ; Conference date: 09-09-2001 Through 13-09-2001",

}

Paasi, J, Vuorinen, R, Maijala, P, Palmen, H & Salminen, V 2001, Performance of fiber based ESD protective packaging. in Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2001. IEEE Institute of Electrical and Electronic Engineers, pp. 50-54, 2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23, Portland, Oregon, United States, 9/09/01. <https://ieeexplore.ieee.org/document/5254989>

TY - GEN

T1 - Performance of fiber based ESD protective packaging

AU - Paasi, Jaakko

AU - Vuorinen, Riku

AU - Maijala, Pekka

AU - Palmen, Helge

AU - Salminen, Veijo

PY - 2001

Y1 - 2001

N2 - We have studied the performance (surface resistance, charge decay and electrostatic discharge shielding properties) of 100 % recyclable, biodegradable, fiber based ESD protective packages and packaging materials. The measurements have been done in the humidity range of 5 - 95 % RH, representing extreme environmental conditions experienced by electronic products during global transportation and storage. The tested fiber based materials seem very promising for the new generation of ESD protective packaging. They can shield ESD sensitive electronics from external ESD contact discharges of several kV magnitude and effectively dissipate or migrate electric charge.

AB - We have studied the performance (surface resistance, charge decay and electrostatic discharge shielding properties) of 100 % recyclable, biodegradable, fiber based ESD protective packages and packaging materials. The measurements have been done in the humidity range of 5 - 95 % RH, representing extreme environmental conditions experienced by electronic products during global transportation and storage. The tested fiber based materials seem very promising for the new generation of ESD protective packaging. They can shield ESD sensitive electronics from external ESD contact discharges of several kV magnitude and effectively dissipate or migrate electric charge.

M3 - Conference article in proceedings

SN - 978-1-5853-7039-9

SP - 50

EP - 54

BT - Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2001

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23

Y2 - 9 September 2001 through 13 September 2001

ER -

Performance of fiber based ESD protective packaging

Abstract

Conference

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