Performance of fiber based ESD protective packaging

Jaakko Paasi, Riku Vuorinen, Pekka Maijala, Helge Palmen, Veijo Salminen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific


    We have studied the performance (surface resistance, charge decay and electrostatic discharge shielding properties) of 100 % recyclable, biodegradable, fiber based ESD protective packages and packaging materials. The measurements have been done in the humidity range of 5 - 95 % RH, representing extreme environmental conditions experienced by electronic products during global transportation and storage. The tested fiber based materials seem very promising for the new generation of ESD protective packaging. They can shield ESD sensitive electronics from external ESD contact discharges of several kV magnitude and effectively dissipate or migrate electric charge.
    Original languageEnglish
    Title of host publicationElectrical Overstress/Electrostatic Discharge Symposium Proceedings 2001
    PublisherIEEE Institute of Electrical and Electronic Engineers
    ISBN (Print)978-1-5853-7039-9
    Publication statusPublished - 2001
    MoE publication typeB3 Non-refereed article in conference proceedings
    Event2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23 - Portland, United States
    Duration: 9 Sept 200113 Sept 2001


    Conference2001 Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium, EOS-23
    Country/TerritoryUnited States


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