Phase field modeling of rapid resolidification of Al-Cu thin films

Tatu Pinomaa (Corresponding Author), Joseph McKeown, Jörg Wiezorek, Nikolas Provatas, Anssi Laukkanen, Tomi Suhonen

    Research output: Contribution to journalArticleScientificpeer-review

    Abstract

    A binary alloy multi-order parameter phase field model is used to study rapid solidification in Al-Cu under conditions corresponding to recent dynamic transmission electron microscopy (DTEM) experiments. The phase field model's sharp interface limit is set through a recent matched asymptotic analysis to follow the solute trapping and interface undercooling kinetics of the Continuous Growth Model (CGM). The phase field model convergence to the CGM sharp interface model is investigated, and based on this an optimal interface width is chosen to simulate the DTEM experimental conditions. The temperature distribution used in the phase field simulations is taken from an analytic expression extracted from experiments. Simulated solidification structures are compared to experiments, including time-resolved DTEM images and post-mortem TEM-based image quality and orientation maps. We find that the large scale morphological features of the simulated microstructures are in good agreement with the experiments, and the corresponding concentration profiles that emerge are in qualitative agreement with experiments. These results show that phase field simulations, informed with DTEM experiments, provides a promising framework to investigate rapidly solidified microstructure evolution and solute segregation, and to calibrate hard-to-determine solidification parameters.

    Original languageEnglish
    Article number125418
    JournalJournal of Crystal Growth
    Volume532
    DOIs
    Publication statusPublished - 15 Feb 2020
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Thin films
    Transmission electron microscopy
    thin films
    transmission electron microscopy
    Experiments
    solidification
    Solidification
    solutes
    rapid solidification
    microstructure
    Microstructure
    Undercooling
    Rapid solidification
    Asymptotic analysis
    Binary alloys
    supercooling
    binary alloys
    Image quality
    Temperature distribution
    temperature distribution

    Keywords

    • A1. Characterization
    • A1. Computer simulation
    • A1. Crystal morphology
    • A1. Segregation
    • B1. Alloys

    Cite this

    @article{b2a92d6eb0d34fc885f082e9fc7622a2,
    title = "Phase field modeling of rapid resolidification of Al-Cu thin films",
    abstract = "A binary alloy multi-order parameter phase field model is used to study rapid solidification in Al-Cu under conditions corresponding to recent dynamic transmission electron microscopy (DTEM) experiments. The phase field model's sharp interface limit is set through a recent matched asymptotic analysis to follow the solute trapping and interface undercooling kinetics of the Continuous Growth Model (CGM). The phase field model convergence to the CGM sharp interface model is investigated, and based on this an optimal interface width is chosen to simulate the DTEM experimental conditions. The temperature distribution used in the phase field simulations is taken from an analytic expression extracted from experiments. Simulated solidification structures are compared to experiments, including time-resolved DTEM images and post-mortem TEM-based image quality and orientation maps. We find that the large scale morphological features of the simulated microstructures are in good agreement with the experiments, and the corresponding concentration profiles that emerge are in qualitative agreement with experiments. These results show that phase field simulations, informed with DTEM experiments, provides a promising framework to investigate rapidly solidified microstructure evolution and solute segregation, and to calibrate hard-to-determine solidification parameters.",
    keywords = "A1. Characterization, A1. Computer simulation, A1. Crystal morphology, A1. Segregation, B1. Alloys",
    author = "Tatu Pinomaa and Joseph McKeown and J{\"o}rg Wiezorek and Nikolas Provatas and Anssi Laukkanen and Tomi Suhonen",
    year = "2020",
    month = "2",
    day = "15",
    doi = "10.1016/j.jcrysgro.2019.125418",
    language = "English",
    volume = "532",
    journal = "Journal of Crystal Growth",
    issn = "0022-0248",
    publisher = "Elsevier",

    }

    Phase field modeling of rapid resolidification of Al-Cu thin films. / Pinomaa, Tatu (Corresponding Author); McKeown, Joseph; Wiezorek, Jörg; Provatas, Nikolas; Laukkanen, Anssi; Suhonen, Tomi.

    In: Journal of Crystal Growth, Vol. 532, 125418, 15.02.2020.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

    T1 - Phase field modeling of rapid resolidification of Al-Cu thin films

    AU - Pinomaa, Tatu

    AU - McKeown, Joseph

    AU - Wiezorek, Jörg

    AU - Provatas, Nikolas

    AU - Laukkanen, Anssi

    AU - Suhonen, Tomi

    PY - 2020/2/15

    Y1 - 2020/2/15

    N2 - A binary alloy multi-order parameter phase field model is used to study rapid solidification in Al-Cu under conditions corresponding to recent dynamic transmission electron microscopy (DTEM) experiments. The phase field model's sharp interface limit is set through a recent matched asymptotic analysis to follow the solute trapping and interface undercooling kinetics of the Continuous Growth Model (CGM). The phase field model convergence to the CGM sharp interface model is investigated, and based on this an optimal interface width is chosen to simulate the DTEM experimental conditions. The temperature distribution used in the phase field simulations is taken from an analytic expression extracted from experiments. Simulated solidification structures are compared to experiments, including time-resolved DTEM images and post-mortem TEM-based image quality and orientation maps. We find that the large scale morphological features of the simulated microstructures are in good agreement with the experiments, and the corresponding concentration profiles that emerge are in qualitative agreement with experiments. These results show that phase field simulations, informed with DTEM experiments, provides a promising framework to investigate rapidly solidified microstructure evolution and solute segregation, and to calibrate hard-to-determine solidification parameters.

    AB - A binary alloy multi-order parameter phase field model is used to study rapid solidification in Al-Cu under conditions corresponding to recent dynamic transmission electron microscopy (DTEM) experiments. The phase field model's sharp interface limit is set through a recent matched asymptotic analysis to follow the solute trapping and interface undercooling kinetics of the Continuous Growth Model (CGM). The phase field model convergence to the CGM sharp interface model is investigated, and based on this an optimal interface width is chosen to simulate the DTEM experimental conditions. The temperature distribution used in the phase field simulations is taken from an analytic expression extracted from experiments. Simulated solidification structures are compared to experiments, including time-resolved DTEM images and post-mortem TEM-based image quality and orientation maps. We find that the large scale morphological features of the simulated microstructures are in good agreement with the experiments, and the corresponding concentration profiles that emerge are in qualitative agreement with experiments. These results show that phase field simulations, informed with DTEM experiments, provides a promising framework to investigate rapidly solidified microstructure evolution and solute segregation, and to calibrate hard-to-determine solidification parameters.

    KW - A1. Characterization

    KW - A1. Computer simulation

    KW - A1. Crystal morphology

    KW - A1. Segregation

    KW - B1. Alloys

    UR - http://www.scopus.com/inward/record.url?scp=85076682342&partnerID=8YFLogxK

    U2 - 10.1016/j.jcrysgro.2019.125418

    DO - 10.1016/j.jcrysgro.2019.125418

    M3 - Article

    VL - 532

    JO - Journal of Crystal Growth

    JF - Journal of Crystal Growth

    SN - 0022-0248

    M1 - 125418

    ER -