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Photonic contact thermometry based on 3 µm thick silicon cascaded ring resonators

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Abstract

We demonstrate a photonic temperature sensor based on three silicon cascaded ring resonators (CRRs) integrated on a 3 µm thick silicon-on-insulator (SOI) platform for contact thermometry. A CRR-based sensor achieves an expanded free spectral range (FSR) of 23 nm, enabling a broader operational temperature range compared with the FSR of 1 nm for the single ring resonator. The thick SOI platform offers several advantages, including low propagation loss (less than 0.1 dB cm-1), negligible polarization dependence (approaching zero birefringence) and high-power handling capability (greater than 10 mW) without any resonance shape deformation from two-photon absorption (TPA). Optical coupling was achieved through edge-coupled fibre packaging to the photonic chip. The sensor exhibits a temperature sensitivity of 85 pm K-1 with an uncertainty of 16.1 mK, measured over a temperature range from -20 to 90°C. This article is part of the Theo Murphy meeting issue 'The redefined kelvin: progress and prospects'.

Original languageEnglish
Article number20240457
JournalPhilosophical transactions. Series A, Mathematical, physical, and engineering sciences
Volume384
Issue number2312
DOIs
Publication statusPublished - 15 Jan 2026
MoE publication typeA1 Journal article-refereed

Funding

The project (23FUN01 PhoQuS-T) has received funding from the European Partnership on Metrology, co-financed from the European Union’s Horizon Europe Research and Innovation Programme and by the Participating States.

Keywords

  • cascaded microring resonator
  • photonic thermometry
  • thermometry
  • thick SOI

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