Photonic module integration based on silicon, ceramic and plastic technologies: Dissertation

TY - THES

T1 - Photonic module integration based on silicon, ceramic and plastic technologies

T2 - Dissertation

AU - Keränen, Kimmo

PY - 2008

Y1 - 2008

N2 - This thesis reports the main results in photonic module integration using silicon, multilayer ceramic and plastic technologies. In order to implement high-performance photonic modules the accurate alignment between critical devices and components is very essential. Cost-efficient photonic modules in volume production can be achieved, when the alignment of devices and components is implemented passively. Utilization of lithographic manufacturing process in silicon processing ensures that the required alignment tolerances between devices are well possible to achieve with photonic modules. The capability of silicon technology to produce a monolithically integrated photonic sensor system, a miniaturized infrared (IR) spectrometer, is studied and evaluated in this work. The capability of a multilayer ceramics substrate to act as an optical platform for a miniature profilometer and an optical bench for passive alignment of laser chip and fiber is evaluated. The components of the miniature profilometer are aligned below +/- 100 µm transverse tolerance passively, which enables operational sensor module implementation. The multilayer ceramic optical bench substrate demonstrates transverse passive alignment tolerances of 3 . 10 m in laser-to-fiber coupling. The tolerances are at adequate level for multimode couplings, but inadequate for single-mode couplings. Transverse alignment tolerances below +/-60 µm are achieved between source and lens surface using in-mold integration with a novel VCSEL illuminator. In addition, a fully operational microscope lens system for Nokia 6630 mobile phone using in-mold integration is designed, implemented and evaluated.

AB - This thesis reports the main results in photonic module integration using silicon, multilayer ceramic and plastic technologies. In order to implement high-performance photonic modules the accurate alignment between critical devices and components is very essential. Cost-efficient photonic modules in volume production can be achieved, when the alignment of devices and components is implemented passively. Utilization of lithographic manufacturing process in silicon processing ensures that the required alignment tolerances between devices are well possible to achieve with photonic modules. The capability of silicon technology to produce a monolithically integrated photonic sensor system, a miniaturized infrared (IR) spectrometer, is studied and evaluated in this work. The capability of a multilayer ceramics substrate to act as an optical platform for a miniature profilometer and an optical bench for passive alignment of laser chip and fiber is evaluated. The components of the miniature profilometer are aligned below +/- 100 µm transverse tolerance passively, which enables operational sensor module implementation. The multilayer ceramic optical bench substrate demonstrates transverse passive alignment tolerances of 3 . 10 m in laser-to-fiber coupling. The tolerances are at adequate level for multimode couplings, but inadequate for single-mode couplings. Transverse alignment tolerances below +/-60 µm are achieved between source and lens surface using in-mold integration with a novel VCSEL illuminator. In addition, a fully operational microscope lens system for Nokia 6630 mobile phone using in-mold integration is designed, implemented and evaluated.

KW - device

KW - multi-layer ceramic

KW - plastic

KW - substrate

KW - module

KW - alignment structures

KW - passive alignment

KW - hermetic

KW - encapsulation

KW - integration

KW - injection molding

KW - cost-efficiency

M3 - Dissertation

SN - 978-951-38-7115-4

T3 - VTT Publications

PB - VTT Technical Research Centre of Finland

CY - Espoo

ER -