Abstract
This thesis reports the main results in photonic module
integration using silicon, multilayer ceramic and plastic
technologies.
In order to implement high-performance photonic modules
the accurate alignment between critical devices and
components is very essential. Cost-efficient photonic
modules in volume production can be achieved, when the
alignment of devices and components is implemented
passively. Utilization of lithographic manufacturing
process in silicon processing ensures that the required
alignment tolerances between devices are well possible to
achieve with photonic modules. The capability of silicon
technology to produce a monolithically integrated
photonic sensor system, a miniaturized infrared (IR)
spectrometer, is studied and evaluated in this work.
The capability of a multilayer ceramics substrate to act
as an optical platform for a miniature profilometer and
an optical bench for passive alignment of laser chip and
fiber is evaluated. The components of the miniature
profilometer are aligned below +/- 100 µm transverse
tolerance passively, which enables operational sensor
module implementation. The multilayer ceramic optical
bench substrate demonstrates transverse passive alignment
tolerances of 3 . 10 m in laser-to-fiber coupling. The
tolerances are at adequate level for multimode couplings,
but inadequate for single-mode couplings.
Transverse alignment tolerances below +/-60 µm are
achieved between source and lens surface using in-mold
integration with a novel VCSEL illuminator. In addition,
a fully operational microscope lens system for Nokia 6630
mobile phone using in-mold integration is designed,
implemented and evaluated.
Original language | English |
---|---|
Qualification | Doctor Degree |
Awarding Institution |
|
Supervisors/Advisors |
|
Award date | 14 Nov 2008 |
Place of Publication | Espoo |
Publisher | |
Print ISBNs | 978-951-38-7115-4 |
Electronic ISBNs | 978-951-38-7116-1 |
Publication status | Published - 2008 |
MoE publication type | G5 Doctoral dissertation (article) |
Keywords
- device
- multi-layer ceramic
- plastic
- substrate
- module
- alignment structures
- passive alignment
- hermetic
- encapsulation
- integration
- injection molding
- cost-efficiency