Keyphrases
3D Applications
25%
3D Architecture
25%
3D Integration
25%
3D Memory
100%
Active Layer
25%
All-silicon
25%
Aspect Ratio
50%
Atomic Composition
25%
Binary Chalcogenide
25%
Chalcogenide Materials
100%
Chalcogenide Thin Films
75%
Chalcogenides
75%
Deposited Film
25%
Electrical Characterization
100%
Electrical Properties
25%
Energy Dispersive X-ray Spectroscopy
25%
Film Stress
25%
Gap Height
25%
High Aspect Ratio
100%
High Aspect Ratio Features
25%
High Aspect Ratio Structure
25%
Integration Scheme
50%
Memory Application
100%
Memory Device
25%
Memory Integration
25%
Memory Technologies
25%
Metrology
25%
Micromembrane
25%
Microscopic Level
25%
NAND Flash Memory
25%
Optical Microscopy
25%
Optical Profilometry
25%
Ovonic Threshold Switch
25%
Phase Change Random Access Memory (PCRAM)
25%
Physical Characterization
100%
Physical-chemical Properties
25%
Physical-mechanical Properties
25%
Ratio Estimation
25%
Ratio Test
50%
Reaction Kinetics
25%
Scanning Electron Microscopy
25%
Scanning Probe Techniques
25%
Stress Measurement
25%
Ternary Chalcogenides
25%
Three-dimensional (3D)
25%
INIS
applications
100%
architecture
12%
aspect ratio
100%
chalcogenides
100%
chemical properties
12%
depth
12%
devices
25%
electrical properties
12%
energy
12%
films
87%
height
12%
layers
12%
levels
12%
mechanical properties
12%
memory devices
12%
metrology
12%
optical microscopy
12%
physical properties
12%
precursor
12%
probes
12%
range
12%
reaction kinetics
12%
scanning electron microscopy
12%
silicon
25%
stacks
12%
substrates
12%
switches
12%
thickness
12%
thin films
12%
walls
12%
x-ray spectroscopy
12%
Material Science
Chalcogenides
100%
Chemical Property
12%
Film
87%
Phase-Change Memory
12%
Physical Property
12%
Scanning Electron Microscopy
12%
Silicon
25%
Stress Measurement
12%
Thin Films
12%