TY - JOUR
T1 - PIXAPP Photonics Packaging Pilot Line development of a silicon photonic optical transceiver with pluggable fiber connectivity
AU - Bundalo, Ivan Lazar
AU - Morrissey, Padraic Edward
AU - Annoni, Andrea
AU - Baets, Roel
AU - Blache, Fabrice
AU - Breyne, Laurens
AU - Carroll, Lee
AU - Collins, Sean
AU - Dietrich, Philipp Immanuel
AU - Halmo, Leos
AU - Jorge, Filipe
AU - Karppinen, Mikko
AU - Kaunisto, Mikko
AU - Kelly, Brian
AU - Vankerrebrouck, Joris
AU - Koos, Christian
AU - Lahti, Markku
AU - Lambrecht, Joris
AU - Tienforti, Marcello
AU - Lee, Jun Su
AU - Missinne, Jeroen
AU - Ossieur, Peter
AU - Pessina, Roberto
AU - Sterken, Tom
AU - Van Steenberge, Geert
AU - Vannucci, Antonello
AU - Vannucchi, Alessandro
AU - Verplancke, Rik
AU - Wuytens, Pieter
AU - Xu, Yilin
AU - Zoldak, Martin
AU - O'brien, Peter
PY - 2022
Y1 - 2022
N2 - This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPPs open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance.
AB - This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPPs open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance.
KW - Chip scale packaging
KW - Demodulation
KW - Electronic packaging thermal management
KW - Electronics packaging
KW - Electrooptic modulators
KW - High-speed electronics
KW - High-speed integrated circuits
KW - High-speed optical techniques
KW - Integrated optics
KW - Intensity modulation
KW - Modulation
KW - Optical device fabrication
KW - Optical fibers
KW - Optical transmitters
KW - Packaging
KW - Photonics
KW - PIC
KW - PIC packaging
KW - communication systems
KW - modulation
KW - telecommunications
KW - semiconductor device packaging
KW - high-speed integrated circuits
KW - intensity modulation
KW - silicon photonics
KW - photonics
KW - high-speed electronics
KW - demodulation
KW - electronic packaging thermal management
KW - chip scale packaging
KW - electronics packaging
UR - http://www.scopus.com/inward/record.url?scp=85126524605&partnerID=8YFLogxK
U2 - 10.1109/JSTQE.2022.3158891
DO - 10.1109/JSTQE.2022.3158891
M3 - Article
AN - SCOPUS:85126524605
SN - 1077-260X
VL - 28
JO - IEEE Journal of Selected Topics in Quantum Electronics
JF - IEEE Journal of Selected Topics in Quantum Electronics
IS - 3
M1 - 8300311
ER -