PIXAPP Photonics Packaging Pilot Line development of a silicon photonic optical transceiver with pluggable fiber connectivity

Ivan Lazar Bundalo, Padraic Edward Morrissey, Andrea Annoni, Roel Baets, Fabrice Blache, Laurens Breyne, Lee Carroll, Sean Collins, Philipp Immanuel Dietrich, Leos Halmo, Filipe Jorge, Mikko Karppinen, Mikko Kaunisto, Brian Kelly, Joris Vankerrebrouck, Christian Koos, Markku Lahti, Joris Lambrecht, Marcello Tienforti, Jun Su LeeJeroen Missinne, Peter Ossieur, Roberto Pessina, Tom Sterken, Geert Van Steenberge, Antonello Vannucci, Alessandro Vannucchi, Rik Verplancke, Pieter Wuytens, Yilin Xu, Martin Zoldak, Peter O'brien

Research output: Contribution to journalArticleScientificpeer-review

Abstract

This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPPs open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance.

Original languageEnglish
Article number8300311
Number of pages11
JournalIEEE Journal of Selected Topics in Quantum Electronics
Volume28
Issue number3
DOIs
Publication statusPublished - 2022
MoE publication typeA1 Journal article-refereed

Keywords

  • Chip scale packaging
  • Demodulation
  • Electronic packaging thermal management
  • Electronics packaging
  • Electrooptic modulators
  • High-speed electronics
  • High-speed integrated circuits
  • High-speed optical techniques
  • Integrated optics
  • Intensity modulation
  • Modulation
  • Optical device fabrication
  • Optical fibers
  • Optical transmitters
  • Packaging
  • Photonics
  • PIC
  • PIC packaging
  • communication systems
  • modulation
  • telecommunications
  • semiconductor device packaging
  • high-speed integrated circuits
  • intensity modulation
  • silicon photonics
  • photonics
  • high-speed electronics
  • demodulation
  • electronic packaging thermal management
  • chip scale packaging
  • electronics packaging

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