"Plug-up"

A new concept for fabricating SOI MEMS devices

Jyrki Kiihamäki (Corresponding Author), James Dekker, Panu Pekko, Hannu Kattelus, Teuvo Sillanpää, Tomi Mattila

Research output: Contribution to journalArticleScientificpeer-review

10 Citations (Scopus)

Abstract

This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.
Original languageEnglish
Pages (from-to)346 - 350
Number of pages5
JournalMicrosystem Technologies
Volume10
Issue number5
DOIs
Publication statusPublished - 2004
MoE publication typeA1 Journal article-refereed

Fingerprint

Silicon
plugs
microelectromechanical systems
MEMS
insulators
silicon
wafers
Hydrofluoric Acid
stiction
Stiction
cavities
Hydrofluoric acid
endurance
hydrofluoric acid
immunity
elimination
Etching
Durability
conductors
Metals

Keywords

  • SOI
  • wafer bonding
  • wafers
  • MEMS

Cite this

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title = "{"}Plug-up{"}: A new concept for fabricating SOI MEMS devices",
abstract = "This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.",
keywords = "SOI, wafer bonding, wafers, MEMS",
author = "Jyrki Kiiham{\"a}ki and James Dekker and Panu Pekko and Hannu Kattelus and Teuvo Sillanp{\"a}{\"a} and Tomi Mattila",
year = "2004",
doi = "10.1007/s00542-004-0414-3",
language = "English",
volume = "10",
pages = "346 -- 350",
journal = "Microsystem Technologies",
issn = "0946-7076",
publisher = "Springer",
number = "5",

}

"Plug-up" : A new concept for fabricating SOI MEMS devices. / Kiihamäki, Jyrki (Corresponding Author); Dekker, James; Pekko, Panu; Kattelus, Hannu; Sillanpää, Teuvo; Mattila, Tomi.

In: Microsystem Technologies, Vol. 10, No. 5, 2004, p. 346 - 350.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - "Plug-up"

T2 - A new concept for fabricating SOI MEMS devices

AU - Kiihamäki, Jyrki

AU - Dekker, James

AU - Pekko, Panu

AU - Kattelus, Hannu

AU - Sillanpää, Teuvo

AU - Mattila, Tomi

PY - 2004

Y1 - 2004

N2 - This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.

AB - This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.

KW - SOI

KW - wafer bonding

KW - wafers

KW - MEMS

U2 - 10.1007/s00542-004-0414-3

DO - 10.1007/s00542-004-0414-3

M3 - Article

VL - 10

SP - 346

EP - 350

JO - Microsystem Technologies

JF - Microsystem Technologies

SN - 0946-7076

IS - 5

ER -