"Plug-up": A new concept for fabricating SOI MEMS devices

Jyrki Kiihamäki (Corresponding Author), James Dekker, Panu Pekko, Hannu Kattelus, Teuvo Sillanpää, Tomi Mattila

    Research output: Contribution to journalArticleScientificpeer-review

    10 Citations (Scopus)

    Abstract

    This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.
    Original languageEnglish
    Pages (from-to)346 - 350
    Number of pages5
    JournalMicrosystem Technologies
    Volume10
    Issue number5
    DOIs
    Publication statusPublished - 2004
    MoE publication typeA1 Journal article-refereed

    Keywords

    • SOI
    • wafer bonding
    • wafers
    • MEMS

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