"Plug-up": A new concept for fabricating SOI MEMS devices

Jyrki Kiihamäki; James Dekker; Panu Pekko; Hannu Kattelus; Teuvo Sillanpää; Tomi Mattila

doi:10.1007/s00542-004-0414-3

"Plug-up": A new concept for fabricating SOI MEMS devices

Jyrki Kiihamäki (Corresponding Author), James Dekker, Panu Pekko, Hannu Kattelus, Teuvo Sillanpää, Tomi Mattila

Research output: Contribution to journal › Article › Scientific › peer-review

13 Citations (Scopus)

Abstract

This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.

Original language	English
Pages (from-to)	346 - 350
Number of pages	5
Journal	Microsystem Technologies
Volume	10
Issue number	5
DOIs	https://doi.org/10.1007/s00542-004-0414-3
Publication status	Published - 2004
MoE publication type	A1 Journal article-refereed

Keywords

SOI
wafer bonding
wafers
MEMS

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10.1007/s00542-004-0414-3

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title = "{"}Plug-up{"}: A new concept for fabricating SOI MEMS devices",

abstract = "This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.",

keywords = "SOI, wafer bonding, wafers, MEMS",

author = "Jyrki Kiiham{\"a}ki and James Dekker and Panu Pekko and Hannu Kattelus and Teuvo Sillanp{\"a}{\"a} and Tomi Mattila",

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T2 - A new concept for fabricating SOI MEMS devices

AU - Kiihamäki, Jyrki

AU - Dekker, James

AU - Pekko, Panu

AU - Kattelus, Hannu

AU - Sillanpää, Teuvo

AU - Mattila, Tomi

PY - 2004

Y1 - 2004

N2 - This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.

AB - This paper reports a novel process sequence for fabricating micromechanical devices on silicon-on-insulator (SOI) wafers. Among the merits of the described process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching in hydrofluoric acid. With this novel process one can controllably embed vacuum cavities within SOI substrates. Further processing of such cavity wafers enables realization of a wide variety of micromechanical devices based on single crystalline silicon or even integrated read-out circuitry.

KW - SOI

KW - wafer bonding

KW - wafers

KW - MEMS

U2 - 10.1007/s00542-004-0414-3

DO - 10.1007/s00542-004-0414-3

M3 - Article

SN - 0946-7076

VL - 10

SP - 346

EP - 350

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 5

ER -

"Plug-up": A new concept for fabricating SOI MEMS devices

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Keywords

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