"Plug-up" - A new concept for fabricating SOI MEMS devices

Jyrki Kiihamäki (Corresponding author), Panu Pekko, Hannu Kattelus, Teuvo Sillanpää, Tomi Mattila

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Abstract

This paper reports a novel process sequence for making micromechanical devices on silicon on insulator (SOI) wafers. The merits of the new process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching with hydrofluoric acid (HF). With this new process one can fabricate vacuum cavities on blank SOI substrates. Further processing of these cavity wafers enables the realization of a wide variety of single crystal micromechanical devices.
Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages229-233
ISBN (Print)0-7803-7066-X
DOIs
Publication statusPublished - 2003
MoE publication typeA4 Article in a conference publication
Event5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2003 - Cannes-Mandeliou, France
Duration: 5 May 20037 May 2003

Conference

Conference5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2003
CountryFrance
CityCannes-Mandeliou
Period5/05/037/05/03

Keywords

  • silicon-on-insulator
  • SOI
  • micromachining
  • vacuum sealing
  • porous silicon
  • silicon
  • MEMS
  • fabrication

Fingerprint Dive into the research topics of '"Plug-up" - A new concept for fabricating SOI MEMS devices'. Together they form a unique fingerprint.

  • Cite this

    Kiihamäki, J., Pekko, P., Kattelus, H., Sillanpää, T., & Mattila, T. (2003). "Plug-up" - A new concept for fabricating SOI MEMS devices. In Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003 (pp. 229-233). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/DTIP.2003.1287042