"Plug-up" - A new concept for fabricating SOI MEMS devices

Jyrki Kiihamäki; Panu Pekko; Hannu Kattelus; Teuvo Sillanpää; Tomi Mattila

doi:10.1109/DTIP.2003.1287042

"Plug-up" - A new concept for fabricating SOI MEMS devices

Jyrki Kiihamäki (Corresponding author), Panu Pekko, Hannu Kattelus, Teuvo Sillanpää, Tomi Mattila

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

6 Citations (Scopus)

Abstract

This paper reports a novel process sequence for making micromechanical devices on silicon on insulator (SOI) wafers. The merits of the new process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching with hydrofluoric acid (HF). With this new process one can fabricate vacuum cavities on blank SOI substrates. Further processing of these cavity wafers enables the realization of a wide variety of single crystal micromechanical devices.

Original language	English
Title of host publication	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	229-233
ISBN (Print)	0-7803-7066-X
DOIs	https://doi.org/10.1109/DTIP.2003.1287042
Publication status	Published - 2003
MoE publication type	A4 Article in a conference publication
Event	5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2003 - Cannes-Mandeliou, France Duration: 5 May 2003 → 7 May 2003

Conference

Conference	5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2003
Country/Territory	France
City	Cannes-Mandeliou
Period	5/05/03 → 7/05/03

Keywords

silicon-on-insulator
SOI
micromachining
vacuum sealing
porous silicon
silicon
MEMS
fabrication

Access to Document

10.1109/DTIP.2003.1287042

Cite this

@inproceedings{1e39f81b7a4544d2b085533930f09581,

title = "{"}Plug-up{"} - A new concept for fabricating SOI MEMS devices",

abstract = "This paper reports a novel process sequence for making micromechanical devices on silicon on insulator (SOI) wafers. The merits of the new process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching with hydrofluoric acid (HF). With this new process one can fabricate vacuum cavities on blank SOI substrates. Further processing of these cavity wafers enables the realization of a wide variety of single crystal micromechanical devices.",

keywords = "silicon-on-insulator, SOI, micromachining, vacuum sealing, porous silicon, silicon, MEMS, fabrication",

author = "Jyrki Kiiham{\"a}ki and Panu Pekko and Hannu Kattelus and Teuvo Sillanp{\"a}{\"a} and Tomi Mattila",

note = "Project code: z2su00005; 5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2003 ; Conference date: 05-05-2003 Through 07-05-2003",

year = "2003",

doi = "10.1109/DTIP.2003.1287042",

language = "English",

isbn = "0-7803-7066-X",

pages = "229--233",

booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

}

Kiihamäki, J , Pekko, P, Kattelus, H, Sillanpää, T & Mattila, T 2003, "Plug-up" - A new concept for fabricating SOI MEMS devices. in Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. IEEE Institute of Electrical and Electronic Engineers, pp. 229-233, 5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2003, Cannes-Mandeliou, France, 5/05/03. https://doi.org/10.1109/DTIP.2003.1287042

"Plug-up" - A new concept for fabricating SOI MEMS devices. / Kiihamäki, Jyrki (Corresponding author); Pekko, Panu; Kattelus, Hannu et al.
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. IEEE Institute of Electrical and Electronic Engineers, 2003. p. 229-233.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - "Plug-up" - A new concept for fabricating SOI MEMS devices

AU - Kiihamäki, Jyrki

AU - Pekko, Panu

AU - Kattelus, Hannu

AU - Sillanpää, Teuvo

AU - Mattila, Tomi

N1 - Project code: z2su00005

PY - 2003

Y1 - 2003

N2 - This paper reports a novel process sequence for making micromechanical devices on silicon on insulator (SOI) wafers. The merits of the new process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching with hydrofluoric acid (HF). With this new process one can fabricate vacuum cavities on blank SOI substrates. Further processing of these cavity wafers enables the realization of a wide variety of single crystal micromechanical devices.

AB - This paper reports a novel process sequence for making micromechanical devices on silicon on insulator (SOI) wafers. The merits of the new process are its improved immunity to stiction and elimination of conductor metal endurance problems during sacrificial etching with hydrofluoric acid (HF). With this new process one can fabricate vacuum cavities on blank SOI substrates. Further processing of these cavity wafers enables the realization of a wide variety of single crystal micromechanical devices.

KW - silicon-on-insulator

KW - SOI

KW - micromachining

KW - vacuum sealing

KW - porous silicon

KW - silicon

KW - MEMS

KW - fabrication

U2 - 10.1109/DTIP.2003.1287042

DO - 10.1109/DTIP.2003.1287042

M3 - Conference article in proceedings

SN - 0-7803-7066-X

SP - 229

EP - 233

BT - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2003

Y2 - 5 May 2003 through 7 May 2003

ER -

"Plug-up" - A new concept for fabricating SOI MEMS devices

Abstract

Conference

Keywords

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Cite this