Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

Martin Kulawski; Hannu Luoto; Kimmo Henttinen; Tommi Suni; Frauke Weimar; Jari Mäkinen

doi:10.1109/ASMC.2005.1438758

Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

Martin Kulawski, Hannu Luoto, Kimmo Henttinen, Tommi Suni, Frauke Weimar, Jari Mäkinen

VTT Technical Research Centre of Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

The Paper describes the general need for CMP in the MEMS technology area and the shortcomings of conventional slurry-based polishing techniques for the large scale structures. By introducing fixed Abrasive (FA) polishing it is shown, that benefits of CMP can be introduced to MEMS as the typical problems of pattern erosion of single standing pattern are minimized. With the developed FA processes a wide area of MEMS capable polishing processes, such as smoothing of bulk micro-machined wafers for enabling direct wafer bonding is generated. This in turn leads to enhanced manufacturing possibilities of advanced design micro mechanical structures for future applications.

Original language	English
Title of host publication	IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005
Publisher	Wiley-IEEE Press
Pages	5-10
ISBN (Electronic)	0-7803-8996-4
ISBN (Print)	0-7803-8997-2
DOIs	https://doi.org/10.1109/ASMC.2005.1438758
Publication status	Published - 2005
MoE publication type	A4 Article in a conference publication
Event	2005 IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing - Munich, Germany Duration: 11 Apr 2005 → 12 Apr 2005

Publication series

Series	IEEE International Symposium on Semiconductor Manufacturing: Conference Proceedings
ISSN	1523-553X

Conference

Conference	2005 IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing
Country/Territory	Germany
City	Munich
Period	11/04/05 → 12/04/05

Keywords

CMP
FA
MEMS

Access to Document

10.1109/ASMC.2005.1438758

Cite this

Kulawski, Martin ; Luoto, Hannu ; Henttinen, Kimmo et al. / Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures. IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005. Wiley-IEEE Press, 2005. pp. 5-10 (IEEE International Symposium on Semiconductor Manufacturing: Conference Proceedings).

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title = "Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures",

abstract = "The Paper describes the general need for CMP in the MEMS technology area and the shortcomings of conventional slurry-based polishing techniques for the large scale structures. By introducing fixed Abrasive (FA) polishing it is shown, that benefits of CMP can be introduced to MEMS as the typical problems of pattern erosion of single standing pattern are minimized. With the developed FA processes a wide area of MEMS capable polishing processes, such as smoothing of bulk micro-machined wafers for enabling direct wafer bonding is generated. This in turn leads to enhanced manufacturing possibilities of advanced design micro mechanical structures for future applications.",

keywords = "CMP, FA, MEMS",

author = "Martin Kulawski and Hannu Luoto and Kimmo Henttinen and Tommi Suni and Frauke Weimar and Jari M{\"a}kinen",

note = "Project code: T4SU00246; 2005 IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing ; Conference date: 11-04-2005 Through 12-04-2005",

year = "2005",

doi = "10.1109/ASMC.2005.1438758",

language = "English",

isbn = "0-7803-8997-2",

series = "IEEE International Symposium on Semiconductor Manufacturing: Conference Proceedings",

publisher = "Wiley-IEEE Press",

pages = "5--10",

booktitle = "IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005",

address = "United States",

}

Kulawski, M, Luoto, H, Henttinen, K, Suni, T, Weimar, F & Mäkinen, J 2005, Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures. in IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005. Wiley-IEEE Press, IEEE International Symposium on Semiconductor Manufacturing: Conference Proceedings, pp. 5-10, 2005 IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing, Munich, Bavaria, Germany, 11/04/05. https://doi.org/10.1109/ASMC.2005.1438758

Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures. / Kulawski, Martin; Luoto, Hannu; Henttinen, Kimmo et al.
IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005. Wiley-IEEE Press, 2005. p. 5-10 (IEEE International Symposium on Semiconductor Manufacturing: Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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T1 - Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

AU - Kulawski, Martin

AU - Luoto, Hannu

AU - Henttinen, Kimmo

AU - Suni, Tommi

AU - Weimar, Frauke

AU - Mäkinen, Jari

N1 - Project code: T4SU00246

PY - 2005

Y1 - 2005

N2 - The Paper describes the general need for CMP in the MEMS technology area and the shortcomings of conventional slurry-based polishing techniques for the large scale structures. By introducing fixed Abrasive (FA) polishing it is shown, that benefits of CMP can be introduced to MEMS as the typical problems of pattern erosion of single standing pattern are minimized. With the developed FA processes a wide area of MEMS capable polishing processes, such as smoothing of bulk micro-machined wafers for enabling direct wafer bonding is generated. This in turn leads to enhanced manufacturing possibilities of advanced design micro mechanical structures for future applications.

AB - The Paper describes the general need for CMP in the MEMS technology area and the shortcomings of conventional slurry-based polishing techniques for the large scale structures. By introducing fixed Abrasive (FA) polishing it is shown, that benefits of CMP can be introduced to MEMS as the typical problems of pattern erosion of single standing pattern are minimized. With the developed FA processes a wide area of MEMS capable polishing processes, such as smoothing of bulk micro-machined wafers for enabling direct wafer bonding is generated. This in turn leads to enhanced manufacturing possibilities of advanced design micro mechanical structures for future applications.

KW - CMP

KW - FA

KW - MEMS

U2 - 10.1109/ASMC.2005.1438758

DO - 10.1109/ASMC.2005.1438758

M3 - Conference article in proceedings

SN - 0-7803-8997-2

T3 - IEEE International Symposium on Semiconductor Manufacturing: Conference Proceedings

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BT - IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005

PB - Wiley-IEEE Press

T2 - 2005 IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing

Y2 - 11 April 2005 through 12 April 2005

ER -

Kulawski M, Luoto H, Henttinen K, Suni T, Weimar F, Mäkinen J. Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures. In IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005. Wiley-IEEE Press. 2005. p. 5-10. (IEEE International Symposium on Semiconductor Manufacturing: Conference Proceedings). doi: 10.1109/ASMC.2005.1438758

Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

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