Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

Martin Kulawski, Hannu Luoto, Kimmo Henttinen, Tommi Suni, Frauke Weimar, Jari Mäkinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

The Paper describes the general need for CMP in the MEMS technology area and the shortcomings of conventional slurry-based polishing techniques for the large scale structures. By introducing fixed Abrasive (FA) polishing it is shown, that benefits of CMP can be introduced to MEMS as the typical problems of pattern erosion of single standing pattern are minimized. With the developed FA processes a wide area of MEMS capable polishing processes, such as smoothing of bulk micro-machined wafers for enabling direct wafer bonding is generated. This in turn leads to enhanced manufacturing possibilities of advanced design micro mechanical structures for future applications.
Original languageEnglish
Title of host publicationIEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005
PublisherWiley-IEEE Press
Pages5-10
ISBN (Electronic)0-7803-8996-4
ISBN (Print)0-7803-8997-2
DOIs
Publication statusPublished - 2005
MoE publication typeA4 Article in a conference publication
Event2005 IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing - Munich, Germany
Duration: 11 Apr 200512 Apr 2005

Publication series

SeriesIEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings
ISSN1523-553X

Conference

Conference2005 IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing
Country/TerritoryGermany
CityMunich
Period11/04/0512/04/05

Keywords

  • CMP
  • FA
  • MEMS

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