Abstract
A bonding base for electronic components, and a method. The bonding base comprises: a dielectric basic layer formed of a mixture comprising thermoplastic polymer, the polymer part of which mixture comprises 75 to 95 % by weight of thermoplastic PPO, the polymer part further comprising 5 to 20 % by weight of elastomer which is incompatible with PPO.
CN102482488 A 20120530 CN201080022083 20100514
CN102482488 B 20150311 CN201080022083 20100514
DE602009036432 D1 20160407 DE200960036432T 20090520
EP2253669 A1 20101124 EP20090160716 20090520
EP2253669 B1 20160224 EP20090160716 20090520
IN02385MN2011 A 20120330 IN2011MN02385 20111114
IN293879 B 20180309 IN2011MN02385 20111114
US2012088883 AA 20120412 US20100321432 20100514
US9464190 BB 20161011 US20100321432 20100514
WO10133759 A1 20101125 WO2010FI50391 20100514
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| Original language | English |
|---|---|
| Patent number | EP2253669 |
| IPC | C08L 71/ 00 A I |
| Priority date | 20/05/09 |
| Publication status | Published - 24 Nov 2010 |
| MoE publication type | H1 Granted patent |