PPO composition as bonding base for electronic components, and method

Mikko Karttunen (Inventor), Satu Kortet (Inventor)

    Research output: PatentPatent


    A bonding base for electronic components, and a method. The bonding base comprises: a dielectric basic layer formed of a mixture comprising thermoplastic polymer, the polymer part of which mixture comprises 75 to 95 % by weight of thermoplastic PPO, the polymer part further comprising 5 to 20 % by weight of elastomer which is incompatible with PPO.

    Patent family as of 13.9.2021
    CN102482488 A 20120530 CN201080022083 20100514      
    CN102482488 B 20150311 CN201080022083 20100514      
    DE602009036432 D1 20160407 DE200960036432T 20090520      
    EP2253669 A1 20101124 EP20090160716 20090520      
    EP2253669 B1 20160224 EP20090160716 20090520      
    IN02385MN2011 A 20120330 IN2011MN02385 20111114      
    IN293879 B 20180309 IN2011MN02385 20111114      
    US2012088883 AA 20120412 US20100321432 20100514      
    US9464190 BB 20161011 US20100321432 20100514      
    WO10133759 A1 20101125 WO2010FI50391 20100514

    Link to current patent family on right 

    Original languageEnglish
    Patent numberEP2253669
    IPCC08L 71/ 00 A I
    Priority date20/05/09
    Publication statusPublished - 24 Nov 2010
    MoE publication typeH1 Granted patent


    Dive into the research topics of 'PPO composition as bonding base for electronic components, and method'. Together they form a unique fingerprint.

    Cite this