Precision alignment and cooling structures for photonic packaging on LTCC

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Original languageEnglish
    Title of host publicationProceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology
    Publication statusPublished - 2004
    MoE publication typeA4 Article in a conference publication
    EventIMAPS Conference on Ceramic Interconnect Technology - Denver, United States
    Duration: 26 Apr 200428 Apr 2004

    Conference

    ConferenceIMAPS Conference on Ceramic Interconnect Technology
    CountryUnited States
    CityDenver
    Period26/04/0428/04/04

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