Precision alignment and cooling structures for photonic packaging on LTCC

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publicationProceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
EventIMAPS Conference on Ceramic Interconnect Technology - Denver, United States
Duration: 26 Apr 200428 Apr 2004

Conference

ConferenceIMAPS Conference on Ceramic Interconnect Technology
CountryUnited States
CityDenver
Period26/04/0428/04/04

Cite this

@inproceedings{7ad31324aa4845118dc18b31b92a5586,
title = "Precision alignment and cooling structures for photonic packaging on LTCC",
author = "Kari Kautio and Kimmo Ker{\"a}nen and Jyrki Ollila and Jukka-Tapani M{\"a}kinen and Jussi Hiltunen and Pentti Karioja",
year = "2004",
language = "English",
booktitle = "Proceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology",

}

Kautio, K, Keränen, K, Ollila, J, Mäkinen, J-T, Hiltunen, J & Karioja, P 2004, Precision alignment and cooling structures for photonic packaging on LTCC. in Proceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology. IMAPS Conference on Ceramic Interconnect Technology, Denver, United States, 26/04/04.

Precision alignment and cooling structures for photonic packaging on LTCC. / Kautio, Kari; Keränen, Kimmo; Ollila, Jyrki; Mäkinen, Jukka-Tapani; Hiltunen, Jussi; Karioja, Pentti.

Proceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology. 2004.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Precision alignment and cooling structures for photonic packaging on LTCC

AU - Kautio, Kari

AU - Keränen, Kimmo

AU - Ollila, Jyrki

AU - Mäkinen, Jukka-Tapani

AU - Hiltunen, Jussi

AU - Karioja, Pentti

PY - 2004

Y1 - 2004

M3 - Conference article in proceedings

BT - Proceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology

ER -