Precision alignment and cooling structures for photonic packaging on LTCC

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publicationProceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
EventIMAPS Conference on Ceramic Interconnect Technology - Denver, United States
Duration: 26 Apr 200428 Apr 2004

Conference

ConferenceIMAPS Conference on Ceramic Interconnect Technology
CountryUnited States
CityDenver
Period26/04/0428/04/04

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