Precision alignment and cooling structures for photonic packaging on LTCC

Kari Kautio, Kimmo Keränen, Jyrki Ollila, Jukka-Tapani Mäkinen, Jussi Hiltunen, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology
Publication status	Published - 2004
MoE publication type	A4 Article in a conference publication
Event	IMAPS Conference on Ceramic Interconnect Technology - Denver, United States Duration: 26 Apr 2004 → 28 Apr 2004

Conference	IMAPS Conference on Ceramic Interconnect Technology
Country/Territory	United States
City	Denver
Period	26/04/04 → 28/04/04

Cite this

@inproceedings{7ad31324aa4845118dc18b31b92a5586,

title = "Precision alignment and cooling structures for photonic packaging on LTCC",

author = "Kari Kautio and Kimmo Ker{\"a}nen and Jyrki Ollila and Jukka-Tapani M{\"a}kinen and Jussi Hiltunen and Pentti Karioja",

year = "2004",

language = "English",

booktitle = "Proceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology",

note = "IMAPS Conference on Ceramic Interconnect Technology ; Conference date: 26-04-2004 Through 28-04-2004",

}

TY - GEN

T1 - Precision alignment and cooling structures for photonic packaging on LTCC

AU - Kautio, Kari

AU - Keränen, Kimmo

AU - Ollila, Jyrki

AU - Mäkinen, Jukka-Tapani

AU - Hiltunen, Jussi

AU - Karioja, Pentti

PY - 2004

Y1 - 2004

M3 - Conference article in proceedings

BT - Proceedings of 2004 IMAPS Conference on Ceramic Interconnect Technology

T2 - IMAPS Conference on Ceramic Interconnect Technology

Y2 - 26 April 2004 through 28 April 2004

ER -