Printed diagnostics: the lab of the future will be flat

Research output: Contribution to conferenceConference articleScientific

Original languageEnglish
Publication statusPublished - 2014
Event13th Annual Flexible and Printed Electronics Conference & Exhibition, FlexTech 2014 - Phoenix, United States
Duration: 3 Feb 20146 Feb 2014

Conference

Conference13th Annual Flexible and Printed Electronics Conference & Exhibition, FlexTech 2014
CountryUnited States
CityPhoenix
Period3/02/146/02/14

Cite this

Kololuoma, T., & Liedert, R. (2014). Printed diagnostics: the lab of the future will be flat. Paper presented at 13th Annual Flexible and Printed Electronics Conference & Exhibition, FlexTech 2014, Phoenix, United States.
Kololuoma, Terho ; Liedert, Ralph. / Printed diagnostics: the lab of the future will be flat. Paper presented at 13th Annual Flexible and Printed Electronics Conference & Exhibition, FlexTech 2014, Phoenix, United States.
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title = "Printed diagnostics: the lab of the future will be flat",
author = "Terho Kololuoma and Ralph Liedert",
year = "2014",
language = "English",
note = "13th Annual Flexible and Printed Electronics Conference & Exhibition, FlexTech 2014 ; Conference date: 03-02-2014 Through 06-02-2014",

}

Kololuoma, T & Liedert, R 2014, 'Printed diagnostics: the lab of the future will be flat' Paper presented at 13th Annual Flexible and Printed Electronics Conference & Exhibition, FlexTech 2014, Phoenix, United States, 3/02/14 - 6/02/14, .

Printed diagnostics: the lab of the future will be flat. / Kololuoma, Terho; Liedert, Ralph.

2014. Paper presented at 13th Annual Flexible and Printed Electronics Conference & Exhibition, FlexTech 2014, Phoenix, United States.

Research output: Contribution to conferenceConference articleScientific

TY - CONF

T1 - Printed diagnostics: the lab of the future will be flat

AU - Kololuoma, Terho

AU - Liedert, Ralph

PY - 2014

Y1 - 2014

M3 - Conference article

ER -

Kololuoma T, Liedert R. Printed diagnostics: the lab of the future will be flat. 2014. Paper presented at 13th Annual Flexible and Printed Electronics Conference & Exhibition, FlexTech 2014, Phoenix, United States.