Printed hybrid systems

Pentti Karioja, Jukka-Tapani Mäkinen, Kimmo Keränen, Janne Aikio, Teemu Alajoki, Tuomo Jaakola, Matti Koponen, Antti Keränen, Mikko Heikkinen, Markus Tuomikoski, Riikka Suhonen, Leena Hakalahti, Pälvi Kopola, Jukka Hast, Ralph Liedert, Jussi Hiltunen, Noriyuki Masuda, Antti Kemppainen, Kari Rönkä, Raimo Korhonen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Abstract

This paper presents research activities carried out at VTT Technical Research Centre of Finland in the field of hybrid integration of optics, electronics and mechanics. Main focus area in our research is the manufacturing of electronic modules and product structures with printed electronics, film-over-molding and polymer sheet lamination technologies and the goal is in the next generation of smart systems utilizing monolithic polymer packages. The combination of manufacturing technologies such as roll-to-roll-printing, injection molding and traditional component assembly is called Printed Hybrid Systems (PHS). Several demonstrator structures have been made, which show the potential of polymer packaging technology. One demonstrator example is a laminated structure with embedded LED chips. Element thickness is only 0.3mm and the flexible stack of foils can be bent in two directions after assembly process and was shaped curved using heat and pressure. The combination of printed flexible circuit boards and injection molding has also been demonstrated with several functional modules. The demonstrators illustrate the potential of origami electronics, which can be cut and folded to 3D shapes. It shows that several manufacturing process steps can be eliminated by Printed Hybrid Systems technology. The main benefits of this combination are small size, ruggedness and conformality. The devices are ideally suited for medical applications as the sensitive electronic components are well protected inside the plastic and the structures can be cleaned easily due to the fact that they have no joints or seams that can accumulate dirt or bacteria
Original languageEnglish
Title of host publicationProceedings of SPIE
Subtitle of host publicationNanosensors, Biosensors, and Info-Tech Sensors and Systems 2012
EditorsVijay K. Varadan
PublisherInternational Society for Optics and Photonics SPIE
Number of pages13
ISBN (Print)978-081949001-8
DOIs
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication
EventSPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring: Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 - San Diego, United States
Duration: 11 Mar 201215 Mar 2012

Publication series

SeriesProceedings of SPIE
Volume8344
ISSN0277-786X

Conference

ConferenceSPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
CountryUnited States
CitySan Diego
Period11/03/1215/03/12

Keywords

  • embedding
  • hot lamination
  • multilayer polymer substrate
  • over-molding
  • printed electronics
  • smart system integration

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