Abstract
| Original language | English |
|---|---|
| Title of host publication | Proceedings of SPIE |
| Subtitle of host publication | Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 |
| Editors | Vijay K. Varadan |
| Publisher | International Society for Optics and Photonics SPIE |
| Number of pages | 13 |
| ISBN (Print) | 978-081949001-8 |
| DOIs | |
| Publication status | Published - 2012 |
| MoE publication type | A4 Article in a conference publication |
| Event | SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring: Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 - San Diego, United States Duration: 11 Mar 2012 → 15 Mar 2012 |
Publication series
| Series | Proceedings of SPIE |
|---|---|
| Volume | 8344 |
| ISSN | 0277-786X |
Conference
| Conference | SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring |
|---|---|
| Country | United States |
| City | San Diego |
| Period | 11/03/12 → 15/03/12 |
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Keywords
- embedding
- hot lamination
- multilayer polymer substrate
- over-molding
- printed electronics
- smart system integration
Cite this
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Printed hybrid systems. / Karioja, Pentti; Mäkinen, Jukka-Tapani; Keränen, Kimmo; Aikio, Janne; Alajoki, Teemu; Jaakola, Tuomo; Koponen, Matti; Keränen, Antti; Heikkinen, Mikko; Tuomikoski, Markus; Suhonen, Riikka; Hakalahti, Leena; Kopola, Pälvi; Hast, Jukka; Liedert, Ralph; Hiltunen, Jussi; Masuda, Noriyuki; Kemppainen, Antti; Rönkä, Kari; Korhonen, Raimo.
Proceedings of SPIE: Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012. ed. / Vijay K. Varadan. International Society for Optics and Photonics SPIE, 2012. 83440G (Proceedings of SPIE, Vol. 8344).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Printed hybrid systems
AU - Karioja, Pentti
AU - Mäkinen, Jukka-Tapani
AU - Keränen, Kimmo
AU - Aikio, Janne
AU - Alajoki, Teemu
AU - Jaakola, Tuomo
AU - Koponen, Matti
AU - Keränen, Antti
AU - Heikkinen, Mikko
AU - Tuomikoski, Markus
AU - Suhonen, Riikka
AU - Hakalahti, Leena
AU - Kopola, Pälvi
AU - Hast, Jukka
AU - Liedert, Ralph
AU - Hiltunen, Jussi
AU - Masuda, Noriyuki
AU - Kemppainen, Antti
AU - Rönkä, Kari
AU - Korhonen, Raimo
PY - 2012
Y1 - 2012
N2 - This paper presents research activities carried out at VTT Technical Research Centre of Finland in the field of hybrid integration of optics, electronics and mechanics. Main focus area in our research is the manufacturing of electronic modules and product structures with printed electronics, film-over-molding and polymer sheet lamination technologies and the goal is in the next generation of smart systems utilizing monolithic polymer packages. The combination of manufacturing technologies such as roll-to-roll-printing, injection molding and traditional component assembly is called Printed Hybrid Systems (PHS). Several demonstrator structures have been made, which show the potential of polymer packaging technology. One demonstrator example is a laminated structure with embedded LED chips. Element thickness is only 0.3mm and the flexible stack of foils can be bent in two directions after assembly process and was shaped curved using heat and pressure. The combination of printed flexible circuit boards and injection molding has also been demonstrated with several functional modules. The demonstrators illustrate the potential of origami electronics, which can be cut and folded to 3D shapes. It shows that several manufacturing process steps can be eliminated by Printed Hybrid Systems technology. The main benefits of this combination are small size, ruggedness and conformality. The devices are ideally suited for medical applications as the sensitive electronic components are well protected inside the plastic and the structures can be cleaned easily due to the fact that they have no joints or seams that can accumulate dirt or bacteria
AB - This paper presents research activities carried out at VTT Technical Research Centre of Finland in the field of hybrid integration of optics, electronics and mechanics. Main focus area in our research is the manufacturing of electronic modules and product structures with printed electronics, film-over-molding and polymer sheet lamination technologies and the goal is in the next generation of smart systems utilizing monolithic polymer packages. The combination of manufacturing technologies such as roll-to-roll-printing, injection molding and traditional component assembly is called Printed Hybrid Systems (PHS). Several demonstrator structures have been made, which show the potential of polymer packaging technology. One demonstrator example is a laminated structure with embedded LED chips. Element thickness is only 0.3mm and the flexible stack of foils can be bent in two directions after assembly process and was shaped curved using heat and pressure. The combination of printed flexible circuit boards and injection molding has also been demonstrated with several functional modules. The demonstrators illustrate the potential of origami electronics, which can be cut and folded to 3D shapes. It shows that several manufacturing process steps can be eliminated by Printed Hybrid Systems technology. The main benefits of this combination are small size, ruggedness and conformality. The devices are ideally suited for medical applications as the sensitive electronic components are well protected inside the plastic and the structures can be cleaned easily due to the fact that they have no joints or seams that can accumulate dirt or bacteria
KW - embedding
KW - hot lamination
KW - multilayer polymer substrate
KW - over-molding
KW - printed electronics
KW - smart system integration
U2 - 10.1117/12.915206
DO - 10.1117/12.915206
M3 - Conference article in proceedings
SN - 978-081949001-8
T3 - Proceedings of SPIE
BT - Proceedings of SPIE
A2 - Varadan, Vijay K.
PB - International Society for Optics and Photonics SPIE
ER -