Abstract
This paper presents research activities carried out at
VTT Technical Research Centre of Finland in the field of
hybrid integration of optics, electronics and mechanics.
Main focus area in our research is the manufacturing of
electronic modules and product structures with printed
electronics, film-over-molding and polymer sheet
lamination technologies and the goal is in the next
generation of smart systems utilizing monolithic polymer
packages. The combination of manufacturing technologies
such as roll-to-roll-printing, injection molding and
traditional component assembly is called Printed Hybrid
Systems (PHS). Several demonstrator structures have been
made, which show the potential of polymer packaging
technology. One demonstrator example is a laminated
structure with embedded LED chips. Element thickness is
only 0.3mm and the flexible stack of foils can be bent in
two directions after assembly process and was shaped
curved using heat and pressure. The combination of
printed flexible circuit boards and injection molding has
also been demonstrated with several functional modules.
The demonstrators illustrate the potential of origami
electronics, which can be cut and folded to 3D shapes. It
shows that several manufacturing process steps can be
eliminated by Printed Hybrid Systems technology. The main
benefits of this combination are small size, ruggedness
and conformality. The devices are ideally suited for
medical applications as the sensitive electronic
components are well protected inside the plastic and the
structures can be cleaned easily due to the fact that
they have no joints or seams that can accumulate dirt or
bacteria
| Original language | English |
|---|---|
| Title of host publication | Proceedings of SPIE |
| Subtitle of host publication | Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 |
| Editors | Vijay K. Varadan |
| Publisher | International Society for Optics and Photonics SPIE |
| Number of pages | 13 |
| ISBN (Print) | 978-081949001-8 |
| DOIs | |
| Publication status | Published - 2012 |
| MoE publication type | A4 Article in a conference publication |
| Event | SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring: Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 - San Diego, United States Duration: 11 Mar 2012 → 15 Mar 2012 |
Publication series
| Series | Proceedings of SPIE |
|---|---|
| Volume | 8344 |
| ISSN | 0277-786X |
Conference
| Conference | SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring |
|---|---|
| Country/Territory | United States |
| City | San Diego |
| Period | 11/03/12 → 15/03/12 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
-
SDG 9 Industry, Innovation, and Infrastructure
Keywords
- embedding
- hot lamination
- multilayer polymer substrate
- over-molding
- printed electronics
- smart system integration
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