Printed intelligence for consumer products

Liisa Hakola, Christina Gaspar, Anu Ilmonen, Kaisa Lehtinen, Maria Smolander

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

In the Ropas project VTT has developed printed humidity sensors on paper substrate. The goal has been to tailor the humidity sensor performance to be suitable for consumer product use such as on package labels. Printed sensors are thin and flexible, because they are directly printed on paper or plastic substrates. When printed on paper substrate disposability or recyclability is achieved thus making them environmental friendly products. The use of printing technologies also provides cost-effectiveness, because of the use of inexpensive materials, low material consumption and mass-scale fast manufacturing processes.
Original languageEnglish
Title of host publicationProceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages126-139
ISBN (Electronic)978-1-4799-4026-4
ISBN (Print)978-1-4799-4027-1
DOIs
Publication statusPublished - 2014
MoE publication typeA4 Article in a conference publication
Event5th Electronics System-Integration Technology Conference, ESTC 2014 - Helsinki, Finland
Duration: 16 Sep 201418 Sep 2014
Conference number: 5th

Conference

Conference5th Electronics System-Integration Technology Conference, ESTC 2014
Abbreviated titleESTC 2014
CountryFinland
CityHelsinki
Period16/09/1418/09/14

Keywords

  • paper
  • humidity
  • sensor
  • inkjet
  • flexography

Fingerprint Dive into the research topics of 'Printed intelligence for consumer products'. Together they form a unique fingerprint.

  • Cite this

    Hakola, L., Gaspar, C., Ilmonen, A., Lehtinen, K., & Smolander, M. (2014). Printed intelligence for consumer products. In Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014 (pp. 126-139). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ESTC.2014.6962774