Abstract
The present invention relates to a process for forming cobalt nanoparticles and coating them with copper or copper oxide, in which process a copper salt is mixed to a cobalt salt so that the formed salt mixture obtains a cobalt:copper ratio of >1:1, and a reduction is carried out with a reducing gas, whereby nanoparticles are formed while a coating is formed onto their surface.
Patent family as of 16.9.2021
CN102933339 A 20130213 CN201180008976 20110207
CN102933339 B 20151125 CN201180008976 20110207
EP2533923 A1 20121219 EP20110741943 20110207
EP2533923 A4 20180124 EP20110741943 20110207
FI122133 B 20110915 FI20100005126 20100209
FI20105126 A 20110810 FI20100005126 20100209
FI20105126 A0 20100209 FI20100005126 20100209
JP2013518992 T2 20130523 JP20120552434T 20110207
JP5856570 B2 20160210 JP20120552434T 20110207
US2013224490 AA 20130829 US20110577661 20110207
US8617710 BB 20131231 US20110577661 20110207
WO11098665 A1 20110818 WO2011FI50104 20110207
Link to current patent family on right
| Original language | English |
|---|---|
| Patent number | US2013224490 |
| IPC | B22F 9/ 24 A I |
| Priority date | 7/02/11 |
| Publication status | Published - 29 Aug 2013 |
| MoE publication type | H1 Granted patent |