Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Vesa Vuorinen, Glenn Ross, Heikki Viljanen, James Decker, Mervi Paulasto-Krockel

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    The objective of this study was to develop a fully integrated process for wafer level MEMS packaging utilizing PolySi through silicon via (TSV) capped MEMS devices. First, interconnection metallurgy and Solid Liquid Interdiffusion (SLID) bonding process was optimized. Then sc.“vias before bonding” capping process and contact metallizations for Poly-Si TSVs were developed. Finally, the process integration was demonstrated by using piezoelectrically driven MEMSactuators. However, several design and manufacturing related challenges were observed and detailed failure analysis were carried out to resolve these problems.
    Original languageEnglish
    Title of host publication 2018 7th Electronic System-Integration Technology Conference (ESTC)
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Number of pages6
    ISBN (Electronic)978-1-5386-6814-6, 978-1-5386-6813-9
    ISBN (Print)978-1-5386-6815-3
    DOIs
    Publication statusPublished - 2018
    MoE publication typeNot Eligible
    Event7th Electronic System-Integration Technology Conference, ESTC 2018 - Westin Bellevue Hotel and Conference Center Dresden, Dresden, Germany
    Duration: 18 Sep 201821 Sep 2018
    Conference number: 7

    Conference

    Conference7th Electronic System-Integration Technology Conference, ESTC 2018
    Abbreviated titleESTC 2018
    CountryGermany
    CityDresden
    Period18/09/1821/09/18

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