Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS
- Vesa Vuorinen
- , Glenn Ross
- , Heikki Viljanen
- , James Decker
- , Mervi Paulasto-Krockel
- Aalto University
- VTT (former employee or external)
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
4
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(Scopus)