Processing and reliability of bare die LED chip bonding on flexible plastic substrate

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

Abstract

Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and reliability of the bonding and the effect of several bonding parameters were studied. The experiments were done using automatic equipment to manufacture LED ribbons. Reliability of the ribbons was investigated by subjecting them to temperature and humidity of 85 °C and 85 % respectively and by bending tests. It was found that with correct choice of manufacturing parameters, it is possible to attain 100 % yield and the samples produced with optimal parameters can withstand the 85/85 environment for period over 100 days. Furthermore, samples produced this way are not damaged by bending them around cylinders with radiuses of 20 mm and 15 mm, for 10 000 and 27 000 cycles respectively. The good tolerance for bending can mostly be attributed to the small size of the chips.
Original languageEnglish
Title of host publicationElectronic System-Integration Technology Conference (ESTC), 2016 6th
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages1-5
ISBN (Electronic)978-1-5090-1402-6
ISBN (Print)978-1-5090-1403-3
DOIs
Publication statusPublished - 5 Dec 2016
MoE publication typeA4 Article in a conference publication
Event6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, France
Duration: 13 Sep 201616 Sep 2016
Conference number: 6

Conference

Conference6th Electronic System-Integration Technology Conference, ESTC 2016
Abbreviated titleESTC 2016
CountryFrance
CityGrenoble
Period13/09/1616/09/16

Fingerprint

Light emitting diodes
Plastics
Electronic equipment
Substrates
Processing
Bending tests
Semiconductor devices
Metal foil
Adhesives
Atmospheric humidity
Silver
Semiconductor materials
Polymers
Experiments
Temperature

Keywords

  • bonding
  • substrates
  • light emitting diodes
  • curing
  • conductors
  • reliability
  • silver

Cite this

Huttunen, A., Happonen, T., & Välimäki, M. (2016). Processing and reliability of bare die LED chip bonding on flexible plastic substrate. In Electronic System-Integration Technology Conference (ESTC), 2016 6th (pp. 1-5). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/ESTC.2016.7764475
Huttunen, Arttu ; Happonen, Tuomas ; Välimäki, Marja. / Processing and reliability of bare die LED chip bonding on flexible plastic substrate. Electronic System-Integration Technology Conference (ESTC), 2016 6th . Institute of Electrical and Electronic Engineers IEEE, 2016. pp. 1-5
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title = "Processing and reliability of bare die LED chip bonding on flexible plastic substrate",
abstract = "Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and reliability of the bonding and the effect of several bonding parameters were studied. The experiments were done using automatic equipment to manufacture LED ribbons. Reliability of the ribbons was investigated by subjecting them to temperature and humidity of 85 °C and 85 {\%} respectively and by bending tests. It was found that with correct choice of manufacturing parameters, it is possible to attain 100 {\%} yield and the samples produced with optimal parameters can withstand the 85/85 environment for period over 100 days. Furthermore, samples produced this way are not damaged by bending them around cylinders with radiuses of 20 mm and 15 mm, for 10 000 and 27 000 cycles respectively. The good tolerance for bending can mostly be attributed to the small size of the chips.",
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Huttunen, A, Happonen, T & Välimäki, M 2016, Processing and reliability of bare die LED chip bonding on flexible plastic substrate. in Electronic System-Integration Technology Conference (ESTC), 2016 6th . Institute of Electrical and Electronic Engineers IEEE, pp. 1-5, 6th Electronic System-Integration Technology Conference, ESTC 2016, Grenoble, France, 13/09/16. https://doi.org/10.1109/ESTC.2016.7764475

Processing and reliability of bare die LED chip bonding on flexible plastic substrate. / Huttunen, Arttu; Happonen, Tuomas; Välimäki, Marja.

Electronic System-Integration Technology Conference (ESTC), 2016 6th . Institute of Electrical and Electronic Engineers IEEE, 2016. p. 1-5.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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N2 - Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and reliability of the bonding and the effect of several bonding parameters were studied. The experiments were done using automatic equipment to manufacture LED ribbons. Reliability of the ribbons was investigated by subjecting them to temperature and humidity of 85 °C and 85 % respectively and by bending tests. It was found that with correct choice of manufacturing parameters, it is possible to attain 100 % yield and the samples produced with optimal parameters can withstand the 85/85 environment for period over 100 days. Furthermore, samples produced this way are not damaged by bending them around cylinders with radiuses of 20 mm and 15 mm, for 10 000 and 27 000 cycles respectively. The good tolerance for bending can mostly be attributed to the small size of the chips.

AB - Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and reliability of the bonding and the effect of several bonding parameters were studied. The experiments were done using automatic equipment to manufacture LED ribbons. Reliability of the ribbons was investigated by subjecting them to temperature and humidity of 85 °C and 85 % respectively and by bending tests. It was found that with correct choice of manufacturing parameters, it is possible to attain 100 % yield and the samples produced with optimal parameters can withstand the 85/85 environment for period over 100 days. Furthermore, samples produced this way are not damaged by bending them around cylinders with radiuses of 20 mm and 15 mm, for 10 000 and 27 000 cycles respectively. The good tolerance for bending can mostly be attributed to the small size of the chips.

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Huttunen A, Happonen T, Välimäki M. Processing and reliability of bare die LED chip bonding on flexible plastic substrate. In Electronic System-Integration Technology Conference (ESTC), 2016 6th . Institute of Electrical and Electronic Engineers IEEE. 2016. p. 1-5 https://doi.org/10.1109/ESTC.2016.7764475