Processing and reliability of bare die LED chip bonding on flexible plastic substrate

Arttu Huttunen; Tuomas Happonen; Marja Välimäki

doi:10.1109/ESTC.2016.7764475

Processing and reliability of bare die LED chip bonding on flexible plastic substrate

Arttu Huttunen, Tuomas Happonen, Marja Välimäki

University of Oulu

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

5 Citations (Scopus)

Abstract

Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and reliability of the bonding and the effect of several bonding parameters were studied. The experiments were done using automatic equipment to manufacture LED ribbons. Reliability of the ribbons was investigated by subjecting them to temperature and humidity of 85 °C and 85 % respectively and by bending tests. It was found that with correct choice of manufacturing parameters, it is possible to attain 100 % yield and the samples produced with optimal parameters can withstand the 85/85 environment for period over 100 days. Furthermore, samples produced this way are not damaged by bending them around cylinders with radiuses of 20 mm and 15 mm, for 10 000 and 27 000 cycles respectively. The good tolerance for bending can mostly be attributed to the small size of the chips.

Original language	English
Title of host publication	Electronic System-Integration Technology Conference (ESTC), 2016 6th
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	1-5
ISBN (Electronic)	978-1-5090-1402-6
ISBN (Print)	978-1-5090-1403-3
DOIs	https://doi.org/10.1109/ESTC.2016.7764475
Publication status	Published - 5 Dec 2016
MoE publication type	A4 Article in a conference publication
Event	6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, France Duration: 13 Sept 2016 → 16 Sept 2016 Conference number: 6

Conference

Conference	6th Electronic System-Integration Technology Conference, ESTC 2016
Abbreviated title	ESTC 2016
Country/Territory	France
City	Grenoble
Period	13/09/16 → 16/09/16

Keywords

bonding
substrates
light emitting diodes
curing
conductors
reliability
silver

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10.1109/ESTC.2016.7764475

Cite this

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title = "Processing and reliability of bare die LED chip bonding on flexible plastic substrate",

abstract = "Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and reliability of the bonding and the effect of several bonding parameters were studied. The experiments were done using automatic equipment to manufacture LED ribbons. Reliability of the ribbons was investigated by subjecting them to temperature and humidity of 85 °C and 85 % respectively and by bending tests. It was found that with correct choice of manufacturing parameters, it is possible to attain 100 % yield and the samples produced with optimal parameters can withstand the 85/85 environment for period over 100 days. Furthermore, samples produced this way are not damaged by bending them around cylinders with radiuses of 20 mm and 15 mm, for 10 000 and 27 000 cycles respectively. The good tolerance for bending can mostly be attributed to the small size of the chips.",

keywords = "bonding, substrates, light emitting diodes, curing, conductors, reliability, silver",

author = "Arttu Huttunen and Tuomas Happonen and Marja V{\"a}lim{\"a}ki",

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booktitle = "Electronic System-Integration Technology Conference (ESTC), 2016 6th",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "6th Electronic System-Integration Technology Conference, ESTC 2016, ESTC 2016 ; Conference date: 13-09-2016 Through 16-09-2016",

}

Huttunen, A , Happonen, T & Välimäki, M 2016, Processing and reliability of bare die LED chip bonding on flexible plastic substrate. in Electronic System-Integration Technology Conference (ESTC), 2016 6th . IEEE Institute of Electrical and Electronic Engineers, pp. 1-5, 6th Electronic System-Integration Technology Conference, ESTC 2016, Grenoble, France, 13/09/16. https://doi.org/10.1109/ESTC.2016.7764475

Processing and reliability of bare die LED chip bonding on flexible plastic substrate. / Huttunen, Arttu ; Happonen, Tuomas ; Välimäki, Marja.
Electronic System-Integration Technology Conference (ESTC), 2016 6th . IEEE Institute of Electrical and Electronic Engineers, 2016. p. 1-5.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Huttunen, Arttu

AU - Happonen, Tuomas

AU - Välimäki, Marja

N1 - Conference code: 6

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Y1 - 2016/12/5

N2 - Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and reliability of the bonding and the effect of several bonding parameters were studied. The experiments were done using automatic equipment to manufacture LED ribbons. Reliability of the ribbons was investigated by subjecting them to temperature and humidity of 85 °C and 85 % respectively and by bending tests. It was found that with correct choice of manufacturing parameters, it is possible to attain 100 % yield and the samples produced with optimal parameters can withstand the 85/85 environment for period over 100 days. Furthermore, samples produced this way are not damaged by bending them around cylinders with radiuses of 20 mm and 15 mm, for 10 000 and 27 000 cycles respectively. The good tolerance for bending can mostly be attributed to the small size of the chips.

AB - Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and reliability of the bonding and the effect of several bonding parameters were studied. The experiments were done using automatic equipment to manufacture LED ribbons. Reliability of the ribbons was investigated by subjecting them to temperature and humidity of 85 °C and 85 % respectively and by bending tests. It was found that with correct choice of manufacturing parameters, it is possible to attain 100 % yield and the samples produced with optimal parameters can withstand the 85/85 environment for period over 100 days. Furthermore, samples produced this way are not damaged by bending them around cylinders with radiuses of 20 mm and 15 mm, for 10 000 and 27 000 cycles respectively. The good tolerance for bending can mostly be attributed to the small size of the chips.

KW - bonding

KW - substrates

KW - light emitting diodes

KW - curing

KW - conductors

KW - reliability

KW - silver

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ER -

Processing and reliability of bare die LED chip bonding on flexible plastic substrate

Abstract

Conference

Keywords

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