Qubit-Compatible Substrates With Superconducting Through-Silicon Vias

Kestutis Grigoras; Nikolai Yurttagul; Jukka-Pekka Kaikkonen; Elsa T. Mannila; Patrik Eskelinen; D. P. Lozano; H.-X. Li; M. Rommel; D. Shiri; Nils Tiencken; Slawomir Simbierowicz; Alberto Ronzani; Joel Hätinen; Debopam Datta; Visa Vesterinen; Leif Grönberg; J. Biznarova; A. Fadavi Roudsari; S. Kosen; A. Osman; Mika Prunnila; Juha Hassel; J. Bylander; Joonas Govenius

doi:10.1109/TQE.2022.3209881

Qubit-Compatible Substrates With Superconducting Through-Silicon Vias

Kestutis Grigoras
, Nikolai Yurttagul
, Jukka-Pekka Kaikkonen
, Elsa T. Mannila^*
, Patrik Eskelinen
, D. P. Lozano
, H.-X. Li
, M. Rommel
, D. Shiri
, Nils Tiencken
, Slawomir Simbierowicz
, Alberto Ronzani
, Joel Hätinen
, Debopam Datta
, Visa Vesterinen
, Leif Grönberg
, J. Biznarova
, A. Fadavi Roudsari
, S. Kosen
, A. Osman

Mika Prunnila, Juha Hassel, J. Bylander, Joonas Govenius

^*Corresponding author for this work

Chalmers University of Technology

Research output: Contribution to journal › Article › Scientific › peer-review

17 Citations (Scopus)

Abstract

We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips and is a first step toward more complex quantum devices with 3-D integration.

Original language	English
Article number	5100310
Number of pages	11
Journal	IEEE Transactions on Quantum Engineering
Volume	3
DOIs	https://doi.org/10.1109/TQE.2022.3209881
Publication status	Published - 2022
MoE publication type	A1 Journal article-refereed

Funding

This work was supported in part by OpenSuperQ, which has received funding from the European Union’s Horizon 2020 Research and Innovation Programme under Grant 820363. The work at VTT was supported by the Quantum Computer Codevelopment Project funded by the Finnish government and performed as part of the Academy of Finland Centre of Excellence program under Project 336817, Project 312059, and Project 312294. This work was also supported by the European Commission H2020 project EFINED under Grant 766853. The Chalmers work was supported in part by the Wallenberg Center for Quantum Technology and performed at Myfab Chalmers. The work of V. Vesterinen was supported by the Academy of Finland under Grant 321700.

Keywords

Through-silicon vias
Resonators
Qubit
Q-factor
Superconducting microwave devices
quantum coherence
superconducting through-silicon via
TSV
tantalum
titanium nitride
High-Q resonator
Semiconductor device measurement
Electrodes
superconducting through-silicon via (TSV)

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Grigoras, K., Yurttagul, N., Kaikkonen, J.-P., Mannila, E. T., Eskelinen, P., Lozano, D. P., Li, H.-X., Rommel, M., Shiri, D., Tiencken, N., Simbierowicz, S., Ronzani, A., Hätinen, J., Datta, D., Vesterinen, V., Grönberg, L., Biznarova, J., Roudsari, A. F., Kosen, S., ... Govenius, J. (2022). Qubit-Compatible Substrates With Superconducting Through-Silicon Vias. IEEE Transactions on Quantum Engineering, 3, Article 5100310. https://doi.org/10.1109/TQE.2022.3209881

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title = "Qubit-Compatible Substrates With Superconducting Through-Silicon Vias",

abstract = "We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips and is a first step toward more complex quantum devices with 3-D integration.",

keywords = "Through-silicon vias, Resonators, Qubit, Q-factor, Superconducting microwave devices, quantum coherence, superconducting through-silicon via, TSV, tantalum, titanium nitride, High-Q resonator, Semiconductor device measurement, Electrodes, superconducting through-silicon via (TSV)",

author = "Kestutis Grigoras and Nikolai Yurttagul and Jukka-Pekka Kaikkonen and Mannila, \{Elsa T.\} and Patrik Eskelinen and Lozano, \{D. P.\} and H.-X. Li and M. Rommel and D. Shiri and Nils Tiencken and Slawomir Simbierowicz and Alberto Ronzani and Joel H{\"a}tinen and Debopam Datta and Visa Vesterinen and Leif Gr{\"o}nberg and J. Biznarova and Roudsari, \{A. Fadavi\} and S. Kosen and A. Osman and Mika Prunnila and Juha Hassel and J. Bylander and Joonas Govenius",

year = "2022",

doi = "10.1109/TQE.2022.3209881",

language = "English",

volume = "3",

journal = "IEEE Transactions on Quantum Engineering",

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Grigoras, K, Yurttagul, N, Kaikkonen, J-P , Mannila, ET, Eskelinen, P, Lozano, DP, Li, H-X, Rommel, M, Shiri, D, Tiencken, N, Simbierowicz, S, Ronzani, A , Hätinen, J, Datta, D, Vesterinen, V, Grönberg, L, Biznarova, J, Roudsari, AF, Kosen, S, Osman, A, Prunnila, M, Hassel, J, Bylander, J & Govenius, J 2022, 'Qubit-Compatible Substrates With Superconducting Through-Silicon Vias', IEEE Transactions on Quantum Engineering, vol. 3, 5100310. https://doi.org/10.1109/TQE.2022.3209881

TY - JOUR

T1 - Qubit-Compatible Substrates With Superconducting Through-Silicon Vias

AU - Grigoras, Kestutis

AU - Yurttagul, Nikolai

AU - Kaikkonen, Jukka-Pekka

AU - Mannila, Elsa T.

AU - Eskelinen, Patrik

AU - Lozano, D. P.

AU - Li, H.-X.

AU - Rommel, M.

AU - Shiri, D.

AU - Tiencken, Nils

AU - Simbierowicz, Slawomir

AU - Ronzani, Alberto

AU - Hätinen, Joel

AU - Datta, Debopam

AU - Vesterinen, Visa

AU - Grönberg, Leif

AU - Biznarova, J.

AU - Roudsari, A. Fadavi

AU - Kosen, S.

AU - Osman, A.

AU - Prunnila, Mika

AU - Hassel, Juha

AU - Bylander, J.

AU - Govenius, Joonas

PY - 2022

Y1 - 2022

N2 - We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips and is a first step toward more complex quantum devices with 3-D integration.

AB - We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips and is a first step toward more complex quantum devices with 3-D integration.

KW - Through-silicon vias

KW - Resonators

KW - Qubit

KW - Q-factor

KW - Superconducting microwave devices

KW - quantum coherence

KW - superconducting through-silicon via

KW - TSV

KW - tantalum

KW - titanium nitride

KW - High-Q resonator

KW - Semiconductor device measurement

KW - Electrodes

KW - superconducting through-silicon via (TSV)

UR - https://www.scopus.com/pages/publications/85139438681

U2 - 10.1109/TQE.2022.3209881

DO - 10.1109/TQE.2022.3209881

M3 - Article

SN - 2689-1808

VL - 3

JO - IEEE Transactions on Quantum Engineering

JF - IEEE Transactions on Quantum Engineering

M1 - 5100310

ER -

Qubit-Compatible Substrates With Superconducting Through-Silicon Vias

Abstract

Funding

Keywords

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