Quick and clean: Stencil lithography for wafer-scale fabrication of superconducting tunnel junctions

V. Savu, Jani Kivioja, Jouni Ahopelto, J. Brugger

    Research output: Contribution to journalArticleScientificpeer-review

    6 Citations (Scopus)


    This paper presents a resist-less process for parallel fabrication of sub-micrometer Al-AlOx-Al superconducting tunnel junctions. A custom stencil is fabricated containing 200 nm low-stress SiN membranes with micro-apertures. The stencil is aligned and clamped with a 1 mum accuracy to a substrate wafer containing Ti-Au contact electrodes. The junctions are fabricated by evaporating Al from two different angles, with an intermediate in-situ oxidation step. Measurements of the devices down to 0.3 K show stencil lithography is a good candidate for parallel, resist-less patterning of sub-micrometer area tunnel junctions. Challenges are addressed and further developments are proposed.
    Original languageEnglish
    Pages (from-to)242-244
    Number of pages3
    JournalIEEE Transactions on Applied Superconductivity
    Issue number3
    Publication statusPublished - 2009
    MoE publication typeA1 Journal article-refereed



    • Shadow mask
    • Stencil lithography
    • STJ
    • Superconducting tunnel junction

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