R2R process for integrating LEDs on flexible substrate

Eveliina Juntunen, Sami Ihme, Arttu Huttunen, Jukka-Tapani Mäkinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

4 Citations (Scopus)

Abstract

Injection overmoulding enables cost-efficient and fully integrated manufacturing of sealed flexible electronics devices with complex optical and mechanical functionalities. Furthermore, the electrical performance of the system can be improved by adding inorganic components on printed, flexible foil before in mould integration of the structure. The development of such the manufacturing process combining hybrid integrated structures with injection overmoulding is introduced in this paper. Contrary to traditional process of overmoulding the electronics label in sheet format, the flexible foil is processed roll-to-roll throughout the full manufacturing chain providing high-efficiency manufacturing. The paper discusses the manufacturing process development and results with a manufacturing trial of demonstrator processed in roll-to-roll hybrid manufacturing with good yield.
Original languageEnglish
Title of host publication2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages12-16
Number of pages5
ISBN (Electronic)978-1-5386-3055-6
ISBN (Print)978-1-5386-3056-3
DOIs
Publication statusPublished - 2017
MoE publication typeA4 Article in a conference publication
EventIMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Gothenburg, Sweden
Duration: 18 Jul 201720 Jul 2017

Conference

ConferenceIMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Abbreviated titleNordPac
CountrySweden
CityGothenburg
Period18/07/1720/07/17

Keywords

  • light emitting diodes
  • manufacturing processes
  • printing
  • cavity resonators
  • injection molding
  • substrates

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  • Cite this

    Juntunen, E., Ihme, S., Huttunen, A., & Mäkinen, J-T. (2017). R2R process for integrating LEDs on flexible substrate. In 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017 (pp. 12-16). [7993155] IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/NORDPAC.2017.7993155