R2R process for integrating LEDs on flexible substrate

Eveliina Juntunen; Sami Ihme; Arttu Huttunen; Jukka-Tapani Mäkinen

doi:10.1109/NORDPAC.2017.7993155

R2R process for integrating LEDs on flexible substrate

Eveliina Juntunen, Sami Ihme, Arttu Huttunen, Jukka-Tapani Mäkinen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

10 Citations (Scopus)

Abstract

Injection overmoulding enables cost-efficient and fully integrated manufacturing of sealed flexible electronics devices with complex optical and mechanical functionalities. Furthermore, the electrical performance of the system can be improved by adding inorganic components on printed, flexible foil before in mould integration of the structure. The development of such the manufacturing process combining hybrid integrated structures with injection overmoulding is introduced in this paper. Contrary to traditional process of overmoulding the electronics label in sheet format, the flexible foil is processed roll-to-roll throughout the full manufacturing chain providing high-efficiency manufacturing. The paper discusses the manufacturing process development and results with a manufacturing trial of demonstrator processed in roll-to-roll hybrid manufacturing with good yield.

Original language	English
Title of host publication	2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	12-16
ISBN (Electronic)	978-1-5386-3055-6
ISBN (Print)	978-1-5386-3056-3
DOIs	https://doi.org/10.1109/NORDPAC.2017.7993155
Publication status	Published - 2017
MoE publication type	A4 Article in a conference publication
Event	IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Gothenburg, Sweden Duration: 18 Jul 2017 → 20 Jul 2017

Conference

Conference	IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Abbreviated title	NordPac
Country/Territory	Sweden
City	Gothenburg
Period	18/07/17 → 20/07/17

Keywords

light emitting diodes
manufacturing processes
printing
cavity resonators
injection molding
substrates

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/NORDPAC.2017.7993155

Cite this

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title = "R2R process for integrating LEDs on flexible substrate",

abstract = "Injection overmoulding enables cost-efficient and fully integrated manufacturing of sealed flexible electronics devices with complex optical and mechanical functionalities. Furthermore, the electrical performance of the system can be improved by adding inorganic components on printed, flexible foil before in mould integration of the structure. The development of such the manufacturing process combining hybrid integrated structures with injection overmoulding is introduced in this paper. Contrary to traditional process of overmoulding the electronics label in sheet format, the flexible foil is processed roll-to-roll throughout the full manufacturing chain providing high-efficiency manufacturing. The paper discusses the manufacturing process development and results with a manufacturing trial of demonstrator processed in roll-to-roll hybrid manufacturing with good yield.",

keywords = "light emitting diodes, manufacturing processes, printing, cavity resonators, injection molding, substrates",

author = "Eveliina Juntunen and Sami Ihme and Arttu Huttunen and Jukka-Tapani M{\"a}kinen",

year = "2017",

doi = "10.1109/NORDPAC.2017.7993155",

language = "English",

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booktitle = "2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "IMAPS Nordic Conference on Microelectronics Packaging (NordPac), NordPac ; Conference date: 18-07-2017 Through 20-07-2017",

}

Juntunen, E, Ihme, S, Huttunen, A & Mäkinen, J-T 2017, R2R process for integrating LEDs on flexible substrate. in 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017., 7993155, IEEE Institute of Electrical and Electronic Engineers, pp. 12-16, IMAPS Nordic Conference on Microelectronics Packaging (NordPac), Gothenburg, Sweden, 18/07/17. https://doi.org/10.1109/NORDPAC.2017.7993155

R2R process for integrating LEDs on flexible substrate. / Juntunen, Eveliina; Ihme, Sami; Huttunen, Arttu et al.
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017. IEEE Institute of Electrical and Electronic Engineers, 2017. p. 12-16 7993155.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - R2R process for integrating LEDs on flexible substrate

AU - Juntunen, Eveliina

AU - Ihme, Sami

AU - Huttunen, Arttu

AU - Mäkinen, Jukka-Tapani

PY - 2017

Y1 - 2017

N2 - Injection overmoulding enables cost-efficient and fully integrated manufacturing of sealed flexible electronics devices with complex optical and mechanical functionalities. Furthermore, the electrical performance of the system can be improved by adding inorganic components on printed, flexible foil before in mould integration of the structure. The development of such the manufacturing process combining hybrid integrated structures with injection overmoulding is introduced in this paper. Contrary to traditional process of overmoulding the electronics label in sheet format, the flexible foil is processed roll-to-roll throughout the full manufacturing chain providing high-efficiency manufacturing. The paper discusses the manufacturing process development and results with a manufacturing trial of demonstrator processed in roll-to-roll hybrid manufacturing with good yield.

AB - Injection overmoulding enables cost-efficient and fully integrated manufacturing of sealed flexible electronics devices with complex optical and mechanical functionalities. Furthermore, the electrical performance of the system can be improved by adding inorganic components on printed, flexible foil before in mould integration of the structure. The development of such the manufacturing process combining hybrid integrated structures with injection overmoulding is introduced in this paper. Contrary to traditional process of overmoulding the electronics label in sheet format, the flexible foil is processed roll-to-roll throughout the full manufacturing chain providing high-efficiency manufacturing. The paper discusses the manufacturing process development and results with a manufacturing trial of demonstrator processed in roll-to-roll hybrid manufacturing with good yield.

KW - light emitting diodes

KW - manufacturing processes

KW - printing

KW - cavity resonators

KW - injection molding

KW - substrates

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M3 - Conference article in proceedings

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EP - 16

BT - 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017

PB - IEEE Institute of Electrical and Electronic Engineers

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Y2 - 18 July 2017 through 20 July 2017

ER -

R2R process for integrating LEDs on flexible substrate

Abstract

Conference

Keywords

UN SDGs

Access to Document

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