Rapid power cycling of flip-chip components on ceramic substrates

Jaakko Lenkkeri (Corresponding Author), Tuomo Jaakola

Research output: Contribution to journalArticleScientificpeer-review

10 Citations (Scopus)

Abstract

Power cycling has been done for flip-chip and CSP components solder joined onto ceramic substrates. Cycle periods as short as 1 min were applied in the experiments where the chip temperature varied between about 30°C in the power off-state and 100–150°C in the power on-state. Disconnections of the joints were found after 4000–17 000 power cycles. The flip-chip components joined onto low temperature cofired ceramic substrate showed slightly better reliability than the components joined onto alumina substrate. Most of the samples showed clear effects of deterioration of the joints seen as increasing chip temperature for power on-state. The experimental results are compared with calculations based on modified Coffin–Manson equation as well as with one-dimensional simulations.
Original languageEnglish
Pages (from-to)661-668
Number of pages8
JournalMicroelectronics Reliability
Volume41
Issue number5
DOIs
Publication statusPublished - 2001
MoE publication typeA1 Journal article-refereed

Fingerprint

chips
ceramics
cycles
Substrates
Aluminum Oxide
Soldering alloys
Temperature
Deterioration
Alumina
solders
deterioration
aluminum oxides
temperature
Experiments
simulation

Cite this

Lenkkeri, Jaakko ; Jaakola, Tuomo. / Rapid power cycling of flip-chip components on ceramic substrates. In: Microelectronics Reliability. 2001 ; Vol. 41, No. 5. pp. 661-668.
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Rapid power cycling of flip-chip components on ceramic substrates. / Lenkkeri, Jaakko (Corresponding Author); Jaakola, Tuomo.

In: Microelectronics Reliability, Vol. 41, No. 5, 2001, p. 661-668.

Research output: Contribution to journalArticleScientificpeer-review

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AU - Jaakola, Tuomo

PY - 2001

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AB - Power cycling has been done for flip-chip and CSP components solder joined onto ceramic substrates. Cycle periods as short as 1 min were applied in the experiments where the chip temperature varied between about 30°C in the power off-state and 100–150°C in the power on-state. Disconnections of the joints were found after 4000–17 000 power cycles. The flip-chip components joined onto low temperature cofired ceramic substrate showed slightly better reliability than the components joined onto alumina substrate. Most of the samples showed clear effects of deterioration of the joints seen as increasing chip temperature for power on-state. The experimental results are compared with calculations based on modified Coffin–Manson equation as well as with one-dimensional simulations.

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DO - 10.1016/S0026-2714(01)00006-3

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