Abstract
Contact formation of Al on n+‐Si by rapid thermal annealing has been investigated. It was found that contact resistivity of the order of 6×10−7 Ω cm2
can be reproducibly achieved. The uniformity of the contact area
morphology is much improved due to the limited Si migration into the Al metallization. Flat contact morphology can be obtained with a combined technique of ion mixing and rapid thermal annealing.
Original language | English |
---|---|
Pages (from-to) | 652-654 |
Journal | Applied Physics Letters |
Volume | 46 |
Issue number | 7 |
DOIs | |
Publication status | Published - 1985 |
MoE publication type | A1 Journal article-refereed |