Rapid Thermal Characterization of Materials with Ultra-High Resolution of Droplet Size Specimens using the Three-Omega Method

Corinna Grosse, Mohamad Abo Ras, Kestutis Grigoras, Daniel May, Aapo Varpula, Karim Elabshihy, Bernhard Wunderle, Mika Prunnila

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Measuring the thermal conductivity can be challenging, especially for liquids or pastes of small volumes. We developed a measurement chip which is suitable for a fast, accurate and convenient determination of the thermal conductivity and diffusivity of droplet size specimens. The measurement method is based on an extension of the 3-omega measurement technique, the so-called bidirectional 3-omega method. A characterization chip with through-glass vias has been developed, allowing for convenient sample positioning and insertion of the chip into the measurement setup. A very thin passivation layer fabricated by atomic layer deposition enables measuring electrically conductive samples while maintaining good thermal transport through the layer. Sample volumes down to 0.02 mm3 are sufficient for accurate measurements. The measurements can be performed within few minutes. Measurements of the thermal conductivity of different thermal interface materials, like pastes and pads, and several liquids and polymers were performed and compared with results obtained using a standard steady-state technique and literature values. The results obtained with both methods agree well within measurement uncertainty.

Original languageEnglish
Title of host publicationProceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages562-566
Number of pages5
ISBN (Electronic)978-1-5386-1272-9
ISBN (Print)978-1-5386-1273-6
DOIs
Publication statusPublished - 24 Jul 2018
MoE publication typeNot Eligible
Event17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 - San Diego, United States
Duration: 29 May 20181 Jun 2018

Conference

Conference17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
CountryUnited States
CitySan Diego
Period29/05/181/06/18

Keywords

  • thermal characterization platform
  • thermal conductivity
  • thermal diffusivity
  • thermal interface materials
  • three-omega method
  • OtaNano

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