Abstract
Si1-xGex layers were formed through high-dose germanium ion implantation into (100)Si substrates. Two alternative implantation techniques along with that of the single-energy Ge+ implantation were separately adopted: the double-energy Si+ and Ge+ method, and the double-energy Ge+ and Ge++ method. The purpose of the both double-energy methods was to form deeper amorphous layers by using relatively low-dose Si+ or Ge++ ion bombardment while the SiGe alloy layers were created by high dose Ge+ ion implantations. Furthermore, all the amorphized samples were epitaxialy regrown by conventional furnace annealing at temperature of 525 to 600°C. RBS channeling spectroscopy was used for optimizing these implantation processes. Measurements confirm that the double-energy Ge+ and Ge++ method is optimum because of generating fewer residual defects. Additionally, the preliminary result on the regrowth properties of the double-energy Ge+ and Ge++ implanted SiGe layer is also presented.
| Original language | English |
|---|---|
| Pages (from-to) | 212-215 |
| Number of pages | 4 |
| Journal | Physica Scripta |
| Volume | 1994 |
| Issue number | T54 |
| DOIs | |
| Publication status | Published - 1 Jan 1994 |
| MoE publication type | A1 Journal article-refereed |
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