Re-passivation rate and conduction mechanism of surface film on copper in nitrite solutions

Martin Bojinov; Tiina Ikäläinen; Timo Saario

doi:10.1016/j.corsci.2022.110447

Re-passivation rate and conduction mechanism of surface film on copper in nitrite solutions

Martin Bojinov (Corresponding Author), Tiina Ikäläinen, Timo Saario

BA4509 Advanced materials for nuclear energy

University of Chemical Technology and Metallurgy

Research output: Contribution to journal › Article › Scientific › peer-review

3 Citations (Scopus)

Abstract

In this work, an effort was put to verify the usefulness of the potential step re-passivation technique in studying the stress corrosion cracking (SCC) susceptibility of copper in environments simulating the final repository of high-level nuclear waste. Validation experiments in NaNO₂ solutions (0.005, 0.05 and 1.0 M) showed that the technique is applicable with certain boundary conditions. In addition, conduction mechanism of passive films on Cu in nitrites is studied with impedance spectroscopy and quantitatively modeled by the Mixed-Conduction Model for oxide films. As a result, possible correlations between electrochemically derived parameters and SCC susceptibility are found and discussed.

Original language	English
Article number	110447
Number of pages	9
Journal	Corrosion Science
Volume	205
Early online date	25 Jun 2022
DOIs	https://doi.org/10.1016/j.corsci.2022.110447
Publication status	Published - 15 Aug 2022
MoE publication type	A1 Journal article-refereed

Keywords

Copper
Electrochemical impedance spectroscopy
Nitrite solution
Re-passivation
Stress corrosion cracking

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10.1016/j.corsci.2022.110447

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title = "Re-passivation rate and conduction mechanism of surface film on copper in nitrite solutions",

abstract = "In this work, an effort was put to verify the usefulness of the potential step re-passivation technique in studying the stress corrosion cracking (SCC) susceptibility of copper in environments simulating the final repository of high-level nuclear waste. Validation experiments in NaNO2 solutions (0.005, 0.05 and 1.0 M) showed that the technique is applicable with certain boundary conditions. In addition, conduction mechanism of passive films on Cu in nitrites is studied with impedance spectroscopy and quantitatively modeled by the Mixed-Conduction Model for oxide films. As a result, possible correlations between electrochemically derived parameters and SCC susceptibility are found and discussed.",

keywords = "Copper, Electrochemical impedance spectroscopy, Nitrite solution, Re-passivation, Stress corrosion cracking",

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T1 - Re-passivation rate and conduction mechanism of surface film on copper in nitrite solutions

AU - Bojinov, Martin

AU - Ikäläinen, Tiina

AU - Saario, Timo

N1 - Funding Information: The funding of this work within the frames of the project “Susceptibility of Cu-OFP to stress corrosion cracking in sulfide containing environment (SUCCESS)” of the Finnish Research Programme on Nuclear Waste Management 2019–2022 is gratefully acknowledged. Publisher Copyright: © 2022 Elsevier Ltd

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N2 - In this work, an effort was put to verify the usefulness of the potential step re-passivation technique in studying the stress corrosion cracking (SCC) susceptibility of copper in environments simulating the final repository of high-level nuclear waste. Validation experiments in NaNO2 solutions (0.005, 0.05 and 1.0 M) showed that the technique is applicable with certain boundary conditions. In addition, conduction mechanism of passive films on Cu in nitrites is studied with impedance spectroscopy and quantitatively modeled by the Mixed-Conduction Model for oxide films. As a result, possible correlations between electrochemically derived parameters and SCC susceptibility are found and discussed.

AB - In this work, an effort was put to verify the usefulness of the potential step re-passivation technique in studying the stress corrosion cracking (SCC) susceptibility of copper in environments simulating the final repository of high-level nuclear waste. Validation experiments in NaNO2 solutions (0.005, 0.05 and 1.0 M) showed that the technique is applicable with certain boundary conditions. In addition, conduction mechanism of passive films on Cu in nitrites is studied with impedance spectroscopy and quantitatively modeled by the Mixed-Conduction Model for oxide films. As a result, possible correlations between electrochemically derived parameters and SCC susceptibility are found and discussed.

KW - Copper

KW - Electrochemical impedance spectroscopy

KW - Nitrite solution

KW - Re-passivation

KW - Stress corrosion cracking

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VL - 205

JO - Corrosion Science

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Re-passivation rate and conduction mechanism of surface film on copper in nitrite solutions

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Keywords

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