Re-passivation rate and conduction mechanism of surface film on copper in nitrite solutions

Martin Bojinov (Corresponding Author), Tiina Ikäläinen, Timo Saario

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)


In this work, an effort was put to verify the usefulness of the potential step re-passivation technique in studying the stress corrosion cracking (SCC) susceptibility of copper in environments simulating the final repository of high-level nuclear waste. Validation experiments in NaNO2 solutions (0.005, 0.05 and 1.0 M) showed that the technique is applicable with certain boundary conditions. In addition, conduction mechanism of passive films on Cu in nitrites is studied with impedance spectroscopy and quantitatively modeled by the Mixed-Conduction Model for oxide films. As a result, possible correlations between electrochemically derived parameters and SCC susceptibility are found and discussed.

Original languageEnglish
Article number110447
Number of pages9
JournalCorrosion Science
Early online date25 Jun 2022
Publication statusPublished - 15 Aug 2022
MoE publication typeA1 Journal article-refereed


  • Copper
  • Electrochemical impedance spectroscopy
  • Nitrite solution
  • Re-passivation
  • Stress corrosion cracking


Dive into the research topics of 'Re-passivation rate and conduction mechanism of surface film on copper in nitrite solutions'. Together they form a unique fingerprint.

Cite this