Re-passivation rate and conduction mechanism of surface film on copper in nitrite solutions

Martin Bojinov*, Tiina Ikäläinen, Timo Saario

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)

Abstract

In this work, an effort was put to verify the usefulness of the potential step re-passivation technique in studying the stress corrosion cracking (SCC) susceptibility of copper in environments simulating the final repository of high-level nuclear waste. Validation experiments in NaNO2 solutions (0.005, 0.05 and 1.0 M) showed that the technique is applicable with certain boundary conditions. In addition, conduction mechanism of passive films on Cu in nitrites is studied with impedance spectroscopy and quantitatively modeled by the Mixed-Conduction Model for oxide films. As a result, possible correlations between electrochemically derived parameters and SCC susceptibility are found and discussed.

Original languageEnglish
Article number110447
Number of pages9
JournalCorrosion Science
Volume205
Early online date25 Jun 2022
DOIs
Publication statusPublished - 15 Aug 2022
MoE publication typeA1 Journal article-refereed

Funding

The funding of this work within the frames of the project “Susceptibility of Cu-OFP to stress corrosion cracking in sulfide containing environment (SUCCESS)” of the Finnish Research Programme on Nuclear Waste Management 2019–2022 is gratefully acknowledged.

Keywords

  • Copper
  • Electrochemical impedance spectroscopy
  • Nitrite solution
  • Re-passivation
  • Stress corrosion cracking

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