Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate

Markku Åberg, Arto Rantala, Satu Savolainen-Pulli, Jaakko Salonen, Jorma Salmi, Ilkka Suni

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Original languageEnglish
    Title of host publicationEuropean Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings
    Subtitle of host publicationPrague, Czech republic, 18-20 June 2000
    PublisherIMAPS Nordic
    Pages293-298
    ISBN (Print)80-23855-09-3
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Cite this

    Åberg, M., Rantala, A., Savolainen-Pulli, S., Salonen, J., Salmi, J., & Suni, I. (2000). Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate. In European Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings: Prague, Czech republic, 18-20 June 2000 (pp. 293-298). IMAPS Nordic.