Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	European Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings
Subtitle of host publication	Prague, Czech republic, 18-20 June 2000
Publisher	IMAPS Nordic
Pages	293-298
ISBN (Print)	80-23855-09-3
Publication status	Published - 2000
MoE publication type	A4 Article in a conference publication

Cite this

Åberg, M., Rantala, A., Savolainen-Pulli, S., Salonen, J., Salmi, J., & Suni, I. (2000). Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate. In European Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings: Prague, Czech republic, 18-20 June 2000 (pp. 293-298). IMAPS Nordic.

@inproceedings{710037175882491097dc06f16cdd54e8,

title = "Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate",

author = "Markku {\AA}berg and Arto Rantala and Satu Savolainen-Pulli and Jaakko Salonen and Jorma Salmi and Ilkka Suni",

year = "2000",

language = "English",

isbn = "80-23855-09-3",

pages = "293--298",

booktitle = "European Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings",

publisher = "IMAPS Nordic",

address = "Finland",

}

Åberg, M, Rantala, A, Savolainen-Pulli, S, Salonen, J, Salmi, J & Suni, I 2000, Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate. in European Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings: Prague, Czech republic, 18-20 June 2000. IMAPS Nordic, pp. 293-298.

Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate. / Åberg, Markku; Rantala, Arto; Savolainen-Pulli, Satu et al.
European Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings: Prague, Czech republic, 18-20 June 2000. IMAPS Nordic, 2000. p. 293-298.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate

AU - Åberg, Markku

AU - Rantala, Arto

AU - Savolainen-Pulli, Satu

AU - Salonen, Jaakko

AU - Salmi, Jorma

AU - Suni, Ilkka

PY - 2000

Y1 - 2000

M3 - Conference article in proceedings

SN - 80-23855-09-3

SP - 293

EP - 298

BT - European Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings

PB - IMAPS Nordic

ER -

Åberg M, Rantala A, Savolainen-Pulli S, Salonen J, Salmi J, Suni I. Reducing cross-coupling noise in LSI RF circuits by using a Flip-Chip Interconnected Multilayer Redistribution Substrate. In European Microelectronics Packaging and Interconnection Symposium IMAPS-EUROPE 2000 Symposium Proceedings: Prague, Czech republic, 18-20 June 2000. IMAPS Nordic. 2000. p. 293-298