Reducing stiction in Microelectromechanical Systems by nanometer-scale films grown by atomic layer deposition

Riikka Puurunen, Ari Häärä, Heini Ritala, James R. Dekker, Markku Kainlauri, Harri Pohjonen, Tommi Suni, Jyrki Kiihamäki, E. Santala, M. Leskelä, Hannu Kattelus

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    4 Citations (Scopus)

    Abstract

    Stiction during device operation remains one of the mechanisms leading to permanent failure of operating silicon-based MEMS devices (MicroElectroMechanical Systems).
    The goal of this work was to investigate, whether stiction between parallel, smooth silicon surfaces can be decreased by thin inorganic films grown by atomic layer deposition (ALD). Test structures based on the cantilever-beam-array (CBA) method were fabricated and coated with ALD layers varying in chemical nature and roughness.
    Rough crystalline TiO 2 decreased the adhesion energy orders of magnitude as compared to Si and other smooth films, indicating that TiO 2 and other crystalline ALD films are candidates for anti-stiction layers in MEMS.
    Original languageEnglish
    Title of host publicationProceedings
    Subtitle of host publication16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2011
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1887-1890
    ISBN (Electronic)978-1-4577-0156-6
    ISBN (Print)978-1-4577-0157-3
    DOIs
    Publication statusPublished - 2011
    MoE publication typeA4 Article in a conference publication
    Event16th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers’11
    - Beijing, China
    Duration: 5 Jun 20119 Jun 2011

    Conference

    Conference16th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers’11
    Abbreviated titleTRANSDUCERS'11
    CountryChina
    CityBeijing
    Period5/06/119/06/11

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