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Reduction of molybdenum resistivity by a seed layer of Ti-W
Sami Franssila
*
, Hannu Kattelus
, E. Nykänen
*
Corresponding author for this work
VTT Technical Research Centre of Finland
Helsinki University of Technology
VTT (former employee or external)
Research output
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Contribution to journal
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Article
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Scientific
›
peer-review
8
Citations (Scopus)
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Keyphrases
Molybdenum
100%
Resistivity
100%
Seed Layer
100%
Grain Size
25%
Etching Rate
25%
Wet Etching
25%
Field Emission Scanning Electron Microscopy (FE-SEM)
25%
Crystallites
25%
Thick Film
25%
Size Structure
25%
Sputter-deposited
25%
Molybdenum Films
25%
Porosity Reduction
25%
Nucleation Layer
25%
Cubic Structure
25%
Oxidation Etching
25%
Physics
Grain Size
100%
Crystallite
100%
Nucleation
100%
Scanning Electron Microscopy
100%
Thick Films
100%
Porosity
100%
INIS
layers
100%
reduction
100%
molybdenum
100%
thickness
33%
range
33%
films
33%
scanning electron microscopy
16%
oxidation
16%
sputtering
16%
surface area
16%
nucleation
16%
afm
16%
reflection
16%
grain size
16%
slowdown
16%
etching
16%
porosity reduction
16%
Material Science
Electrical Resistivity
100%
Molybdenum
100%
Wet Etching
20%
Grain Size
20%
Nucleation
20%
Field Emission Scanning Electron Microscopy
20%
Film
20%
Thick Films
20%
Crystallite
20%
Agricultural and Biological Sciences
Seeds
100%
Grains
25%
Surface Area
25%
Scanning Electron Microscopy
25%