Reliability assessment and failure mode analysis of MEMS accelerometers for space applications

I. Marozau, M. Auchlin, V. Pejchal, F. Souchon, D. Vogel, Markku Lahti, N. Saillen, O. Sereda

    Research output: Contribution to journalArticleScientificpeer-review

    1 Citation (Scopus)

    Abstract

    In the present work, the reliability assessment of capacitive MEMS accelerometers of 3 different suppliers (codenamed A, B, and C) for their use in space applications was performed. The developed reliability assessment testing program addressed specific severities of space missions, such as mechanical shocks and vibrations during take-off and rocket stages separation, high temperature gradients and radiation endurance during in-orbit operation. The main aim of the testing was to evaluate the robustness and reliability limits of MEMS devices by overstressing their specific properties through dedicated tests. Typical failures modes were analyzed and root-causes identified on the devices’ subsystem level: MEMS structure, ASIC, interconnecting wires, and package. Overall results of the performed reliability assessment tests and failure mode analyses suggest that the most specific MEMS components, namely the microstructures, do not themselves constitute the failure causes. Following the observations, other components, e.g. interconnects, ASIC or packaging, exhibit lower reliability limits to the specific stresses of the space harsh conditions. Comparative analysis of three accelerometers from various suppliers (designs A, B, and C) suggests the design A (in a hermetic ceramic package) to exhibit the best overall reliability for space-specific application conditions. Design B also shows good robustness. However, its non-hermetic packaging makes it unsuitable for the direct use for space applications in the current state. Utilization of a hermetic package and improvement of the wire-bonding temperature resistance would significantly improve this design. Accelerometers of supplier C (in a hermetic ceramic package) have a trend of occasional “infant mortality” early failures. It is therefore very important to perform burn-in and initial pre-screening for these devices. Another strong weak point for this design is related to a low radiation endurance, which shall be significantly improved.

    Original languageEnglish
    Pages (from-to)846-854
    Number of pages9
    JournalMicroelectronics Reliability
    Volume88-90
    DOIs
    Publication statusPublished - 1 Sep 2018
    MoE publication typeNot Eligible

    Fingerprint

    failure modes
    Space applications
    accelerometers
    Accelerometers
    Failure modes
    microelectromechanical systems
    MEMS
    endurance
    application specific integrated circuits
    Application specific integrated circuits
    packaging
    Packaging
    Durability
    stage separation
    mechanical shock
    wire
    Wire
    ceramics
    burn-in
    Radiation

    Keywords

    • FMEA
    • MEMS
    • Reliability
    • Space application

    Cite this

    Marozau, I. ; Auchlin, M. ; Pejchal, V. ; Souchon, F. ; Vogel, D. ; Lahti, Markku ; Saillen, N. ; Sereda, O. / Reliability assessment and failure mode analysis of MEMS accelerometers for space applications. In: Microelectronics Reliability. 2018 ; Vol. 88-90. pp. 846-854.
    @article{b0fe78a469594266a9c715b3d7012c67,
    title = "Reliability assessment and failure mode analysis of MEMS accelerometers for space applications",
    abstract = "In the present work, the reliability assessment of capacitive MEMS accelerometers of 3 different suppliers (codenamed A, B, and C) for their use in space applications was performed. The developed reliability assessment testing program addressed specific severities of space missions, such as mechanical shocks and vibrations during take-off and rocket stages separation, high temperature gradients and radiation endurance during in-orbit operation. The main aim of the testing was to evaluate the robustness and reliability limits of MEMS devices by overstressing their specific properties through dedicated tests. Typical failures modes were analyzed and root-causes identified on the devices’ subsystem level: MEMS structure, ASIC, interconnecting wires, and package. Overall results of the performed reliability assessment tests and failure mode analyses suggest that the most specific MEMS components, namely the microstructures, do not themselves constitute the failure causes. Following the observations, other components, e.g. interconnects, ASIC or packaging, exhibit lower reliability limits to the specific stresses of the space harsh conditions. Comparative analysis of three accelerometers from various suppliers (designs A, B, and C) suggests the design A (in a hermetic ceramic package) to exhibit the best overall reliability for space-specific application conditions. Design B also shows good robustness. However, its non-hermetic packaging makes it unsuitable for the direct use for space applications in the current state. Utilization of a hermetic package and improvement of the wire-bonding temperature resistance would significantly improve this design. Accelerometers of supplier C (in a hermetic ceramic package) have a trend of occasional “infant mortality” early failures. It is therefore very important to perform burn-in and initial pre-screening for these devices. Another strong weak point for this design is related to a low radiation endurance, which shall be significantly improved.",
    keywords = "FMEA, MEMS, Reliability, Space application",
    author = "I. Marozau and M. Auchlin and V. Pejchal and F. Souchon and D. Vogel and Markku Lahti and N. Saillen and O. Sereda",
    year = "2018",
    month = "9",
    day = "1",
    doi = "10.1016/j.microrel.2018.07.118",
    language = "English",
    volume = "88-90",
    pages = "846--854",
    journal = "Microelectronics Reliability",
    issn = "0026-2714",
    publisher = "Elsevier",

    }

    Reliability assessment and failure mode analysis of MEMS accelerometers for space applications. / Marozau, I.; Auchlin, M.; Pejchal, V.; Souchon, F.; Vogel, D.; Lahti, Markku; Saillen, N.; Sereda, O.

    In: Microelectronics Reliability, Vol. 88-90, 01.09.2018, p. 846-854.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

    T1 - Reliability assessment and failure mode analysis of MEMS accelerometers for space applications

    AU - Marozau, I.

    AU - Auchlin, M.

    AU - Pejchal, V.

    AU - Souchon, F.

    AU - Vogel, D.

    AU - Lahti, Markku

    AU - Saillen, N.

    AU - Sereda, O.

    PY - 2018/9/1

    Y1 - 2018/9/1

    N2 - In the present work, the reliability assessment of capacitive MEMS accelerometers of 3 different suppliers (codenamed A, B, and C) for their use in space applications was performed. The developed reliability assessment testing program addressed specific severities of space missions, such as mechanical shocks and vibrations during take-off and rocket stages separation, high temperature gradients and radiation endurance during in-orbit operation. The main aim of the testing was to evaluate the robustness and reliability limits of MEMS devices by overstressing their specific properties through dedicated tests. Typical failures modes were analyzed and root-causes identified on the devices’ subsystem level: MEMS structure, ASIC, interconnecting wires, and package. Overall results of the performed reliability assessment tests and failure mode analyses suggest that the most specific MEMS components, namely the microstructures, do not themselves constitute the failure causes. Following the observations, other components, e.g. interconnects, ASIC or packaging, exhibit lower reliability limits to the specific stresses of the space harsh conditions. Comparative analysis of three accelerometers from various suppliers (designs A, B, and C) suggests the design A (in a hermetic ceramic package) to exhibit the best overall reliability for space-specific application conditions. Design B also shows good robustness. However, its non-hermetic packaging makes it unsuitable for the direct use for space applications in the current state. Utilization of a hermetic package and improvement of the wire-bonding temperature resistance would significantly improve this design. Accelerometers of supplier C (in a hermetic ceramic package) have a trend of occasional “infant mortality” early failures. It is therefore very important to perform burn-in and initial pre-screening for these devices. Another strong weak point for this design is related to a low radiation endurance, which shall be significantly improved.

    AB - In the present work, the reliability assessment of capacitive MEMS accelerometers of 3 different suppliers (codenamed A, B, and C) for their use in space applications was performed. The developed reliability assessment testing program addressed specific severities of space missions, such as mechanical shocks and vibrations during take-off and rocket stages separation, high temperature gradients and radiation endurance during in-orbit operation. The main aim of the testing was to evaluate the robustness and reliability limits of MEMS devices by overstressing their specific properties through dedicated tests. Typical failures modes were analyzed and root-causes identified on the devices’ subsystem level: MEMS structure, ASIC, interconnecting wires, and package. Overall results of the performed reliability assessment tests and failure mode analyses suggest that the most specific MEMS components, namely the microstructures, do not themselves constitute the failure causes. Following the observations, other components, e.g. interconnects, ASIC or packaging, exhibit lower reliability limits to the specific stresses of the space harsh conditions. Comparative analysis of three accelerometers from various suppliers (designs A, B, and C) suggests the design A (in a hermetic ceramic package) to exhibit the best overall reliability for space-specific application conditions. Design B also shows good robustness. However, its non-hermetic packaging makes it unsuitable for the direct use for space applications in the current state. Utilization of a hermetic package and improvement of the wire-bonding temperature resistance would significantly improve this design. Accelerometers of supplier C (in a hermetic ceramic package) have a trend of occasional “infant mortality” early failures. It is therefore very important to perform burn-in and initial pre-screening for these devices. Another strong weak point for this design is related to a low radiation endurance, which shall be significantly improved.

    KW - FMEA

    KW - MEMS

    KW - Reliability

    KW - Space application

    UR - http://www.scopus.com/inward/record.url?scp=85054854832&partnerID=8YFLogxK

    U2 - 10.1016/j.microrel.2018.07.118

    DO - 10.1016/j.microrel.2018.07.118

    M3 - Article

    AN - SCOPUS:85054854832

    VL - 88-90

    SP - 846

    EP - 854

    JO - Microelectronics Reliability

    JF - Microelectronics Reliability

    SN - 0026-2714

    ER -