Skip to main navigation Skip to search Skip to main content

Reliability issues of replacing solder with conductive adhesives in power modules

  • Outi Rusanen
  • , Jaakko Lenkkeri

Research output: Contribution to journalArticleScientificpeer-review

Fingerprint

Dive into the research topics of 'Reliability issues of replacing solder with conductive adhesives in power modules'. Together they form a unique fingerprint.
Sort by

Engineering

INIS

Material Science

Keyphrases