Reliability issues of replacing solder with conductive adhesives in power modules

Outi Rusanen, Jaakko Lenkkeri

Research output: Contribution to journalArticleScientificpeer-review

26 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Reliability issues of replacing solder with conductive adhesives in power modules'. Together they form a unique fingerprint.

Keyphrases

INIS

Engineering

Material Science