Reliability of electrically conductive adhesive interconnections in printed flex-to-flex system integration

Research output: Contribution to conferenceConference articleScientific

Abstract

Electrically conductive adhesives (ECA) facilitate low processing temperatures for interconnecting printed and flexible electronic components into a complete system. This study investigates the reliability of adhesive interconnections when attaching a functional large-area device and a system-level back-plane circuitry. The test samples to be studied are prepared by interconnecting roll-to-roll (R2R) printed organic light emitting diodes (OLEDs) and flexible conductors by using an automated R2R pick-and-place machine. The critical process parameters such as curing time and temperature are varied after dispensing the adhesive to obtain the optimal process recipe for the interconnection procedure. Especially, ensuring proper galvanic connection between the conductors and large-area contacts at the bottom of vias in an OLED element, and the capability to withstand current levels required for OLED powering is under interest. The experimental observations are supported by means of modeling. The reliability of electrically conductive interconnections is assessed by utilizing accelerated lifetime tests, namely temperature cycling, steady state humidity bias and dynamic bending tests. The electrical performance of test samples is monitored with resistance measurements as the increase in resistance indicates the interconnection malfunction. After conducting the tests, the measurement data is examined with Weibull analysis resulting in a cumulative failure rate over time for each test sample population. The results achieved by the study provide guidelines to design the interconnections and the process set-up with reliable output. The results are essential also from the productivity perspective as the curing conditions of adhesive interconnections play an important role in throughput of automated production lines.
Original languageEnglish
Publication statusPublished - 2017
MoE publication typeNot Eligible
Event9th International Exhibition and Conference for the Printed Electronics Industry, LOPEC 2017 - Munich, Germany
Duration: 28 Mar 201730 Mar 2017

Conference

Conference9th International Exhibition and Conference for the Printed Electronics Industry, LOPEC 2017
Abbreviated titleLOPEC 2017
CountryGermany
CityMunich
Period28/03/1730/03/17

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Adhesives
Organic light emitting diodes (OLED)
Curing
Flexible electronics
Bending tests
Temperature
Atmospheric humidity
Productivity
Throughput
Processing

Cite this

Happonen, T., Tuomikoski, M., & Rönkä, K. (2017). Reliability of electrically conductive adhesive interconnections in printed flex-to-flex system integration. Paper presented at 9th International Exhibition and Conference for the Printed Electronics Industry, LOPEC 2017, Munich, Germany.
Happonen, Tuomas ; Tuomikoski, Markus ; Rönkä, Kari. / Reliability of electrically conductive adhesive interconnections in printed flex-to-flex system integration. Paper presented at 9th International Exhibition and Conference for the Printed Electronics Industry, LOPEC 2017, Munich, Germany.
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abstract = "Electrically conductive adhesives (ECA) facilitate low processing temperatures for interconnecting printed and flexible electronic components into a complete system. This study investigates the reliability of adhesive interconnections when attaching a functional large-area device and a system-level back-plane circuitry. The test samples to be studied are prepared by interconnecting roll-to-roll (R2R) printed organic light emitting diodes (OLEDs) and flexible conductors by using an automated R2R pick-and-place machine. The critical process parameters such as curing time and temperature are varied after dispensing the adhesive to obtain the optimal process recipe for the interconnection procedure. Especially, ensuring proper galvanic connection between the conductors and large-area contacts at the bottom of vias in an OLED element, and the capability to withstand current levels required for OLED powering is under interest. The experimental observations are supported by means of modeling. The reliability of electrically conductive interconnections is assessed by utilizing accelerated lifetime tests, namely temperature cycling, steady state humidity bias and dynamic bending tests. The electrical performance of test samples is monitored with resistance measurements as the increase in resistance indicates the interconnection malfunction. After conducting the tests, the measurement data is examined with Weibull analysis resulting in a cumulative failure rate over time for each test sample population. The results achieved by the study provide guidelines to design the interconnections and the process set-up with reliable output. The results are essential also from the productivity perspective as the curing conditions of adhesive interconnections play an important role in throughput of automated production lines.",
author = "Tuomas Happonen and Markus Tuomikoski and Kari R{\"o}nk{\"a}",
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Happonen, T, Tuomikoski, M & Rönkä, K 2017, 'Reliability of electrically conductive adhesive interconnections in printed flex-to-flex system integration' Paper presented at 9th International Exhibition and Conference for the Printed Electronics Industry, LOPEC 2017, Munich, Germany, 28/03/17 - 30/03/17, .

Reliability of electrically conductive adhesive interconnections in printed flex-to-flex system integration. / Happonen, Tuomas; Tuomikoski, Markus; Rönkä, Kari.

2017. Paper presented at 9th International Exhibition and Conference for the Printed Electronics Industry, LOPEC 2017, Munich, Germany.

Research output: Contribution to conferenceConference articleScientific

TY - CONF

T1 - Reliability of electrically conductive adhesive interconnections in printed flex-to-flex system integration

AU - Happonen, Tuomas

AU - Tuomikoski, Markus

AU - Rönkä, Kari

N1 - Project code: 106330

PY - 2017

Y1 - 2017

N2 - Electrically conductive adhesives (ECA) facilitate low processing temperatures for interconnecting printed and flexible electronic components into a complete system. This study investigates the reliability of adhesive interconnections when attaching a functional large-area device and a system-level back-plane circuitry. The test samples to be studied are prepared by interconnecting roll-to-roll (R2R) printed organic light emitting diodes (OLEDs) and flexible conductors by using an automated R2R pick-and-place machine. The critical process parameters such as curing time and temperature are varied after dispensing the adhesive to obtain the optimal process recipe for the interconnection procedure. Especially, ensuring proper galvanic connection between the conductors and large-area contacts at the bottom of vias in an OLED element, and the capability to withstand current levels required for OLED powering is under interest. The experimental observations are supported by means of modeling. The reliability of electrically conductive interconnections is assessed by utilizing accelerated lifetime tests, namely temperature cycling, steady state humidity bias and dynamic bending tests. The electrical performance of test samples is monitored with resistance measurements as the increase in resistance indicates the interconnection malfunction. After conducting the tests, the measurement data is examined with Weibull analysis resulting in a cumulative failure rate over time for each test sample population. The results achieved by the study provide guidelines to design the interconnections and the process set-up with reliable output. The results are essential also from the productivity perspective as the curing conditions of adhesive interconnections play an important role in throughput of automated production lines.

AB - Electrically conductive adhesives (ECA) facilitate low processing temperatures for interconnecting printed and flexible electronic components into a complete system. This study investigates the reliability of adhesive interconnections when attaching a functional large-area device and a system-level back-plane circuitry. The test samples to be studied are prepared by interconnecting roll-to-roll (R2R) printed organic light emitting diodes (OLEDs) and flexible conductors by using an automated R2R pick-and-place machine. The critical process parameters such as curing time and temperature are varied after dispensing the adhesive to obtain the optimal process recipe for the interconnection procedure. Especially, ensuring proper galvanic connection between the conductors and large-area contacts at the bottom of vias in an OLED element, and the capability to withstand current levels required for OLED powering is under interest. The experimental observations are supported by means of modeling. The reliability of electrically conductive interconnections is assessed by utilizing accelerated lifetime tests, namely temperature cycling, steady state humidity bias and dynamic bending tests. The electrical performance of test samples is monitored with resistance measurements as the increase in resistance indicates the interconnection malfunction. After conducting the tests, the measurement data is examined with Weibull analysis resulting in a cumulative failure rate over time for each test sample population. The results achieved by the study provide guidelines to design the interconnections and the process set-up with reliable output. The results are essential also from the productivity perspective as the curing conditions of adhesive interconnections play an important role in throughput of automated production lines.

M3 - Conference article

ER -

Happonen T, Tuomikoski M, Rönkä K. Reliability of electrically conductive adhesive interconnections in printed flex-to-flex system integration. 2017. Paper presented at 9th International Exhibition and Conference for the Printed Electronics Industry, LOPEC 2017, Munich, Germany.