Reliability of silkscreen printed planar capacitors and inductors under accelerated thermal cycling and humidity bias life testing

Juha Veikko Voutilainen, Tuomas Happonen, Juha Häkkinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

Abstract

The reliability of silkscreen printed capacitors and inductors were assessed based on thermal cycling (0-100°C) and humidity bias life (85°C/85%RH) tests. The used fabrication materials were Melinex ST504 polyester as a substrate, Asahi LS-411AW silver paste as a conductor and Asahi CR-18□-KT1 as the dielectric of capacitors and crossover insulator of inductors. Several components' geometries, with and without encapsulation, were studied to find out the influence of size and encapsulation effect on long term reliability. The results show, that thermal cycling induced stresses are not critical for the technology considered. The capacitance increased approximately 20% during the first 3000 cycles, while inductance kept quite constant (±3%). However, the inductor loss resistance decreased almost 10-20%. Humidity bias tests showed quite different results. For example, capacitance of all tested capacitor geometries increased more than 60% after approximately 2500h in an 85°C/85%RH environment. The Weibull analysis showed that larger capacitors are more vulnerable to combined temperature and humidity bias than smaller ones. The Weibull parameters obtained for the large (15mm × 15mm) capacitors under 85°C/85%RH were β = 2.8 and η = 1623. The failure criterion was the total failure of the dielectric. Furthermore, under temperature cycling, the corresponding parameters were β = 3.7 and η = 2486. In these, the failure criterion was the 1st electrical indication of the dielectric deterioration, i.e., a clear drop in the DC resistance. None of the encapsulated components failed during the 85°C/85%RH tests, which suggest that simple lamination enhances the component reliability.

Original languageEnglish
Title of host publication2012 4th Electronic System-Integration Technology Conference, ESTC 2012
PublisherIEEE Institute of Electrical and Electronic Engineers
ISBN (Electronic)978-1-4673-4644-3
ISBN (Print)978-1-4673-4645-0
DOIs
Publication statusPublished - 1 Jan 2012
MoE publication typeA4 Article in a conference publication
Event4th Electronic System-Integration Technology Conference, ESTC 2012 - Amsterdam, Netherlands
Duration: 17 Sep 201220 Sep 2012

Conference

Conference4th Electronic System-Integration Technology Conference, ESTC 2012
CountryNetherlands
CityAmsterdam
Period17/09/1220/09/12

Fingerprint

Thermal cycling
Atmospheric humidity
Capacitors
Testing
Encapsulation
Capacitance
Geometry
Inductance
Deterioration
Polyesters
Silver
Fabrication
Temperature
Substrates

Cite this

Voutilainen, J. V., Happonen, T., & Häkkinen, J. (2012). Reliability of silkscreen printed planar capacitors and inductors under accelerated thermal cycling and humidity bias life testing. In 2012 4th Electronic System-Integration Technology Conference, ESTC 2012 [6542201] IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/ESTC.2012.6542201
Voutilainen, Juha Veikko ; Happonen, Tuomas ; Häkkinen, Juha. / Reliability of silkscreen printed planar capacitors and inductors under accelerated thermal cycling and humidity bias life testing. 2012 4th Electronic System-Integration Technology Conference, ESTC 2012. IEEE Institute of Electrical and Electronic Engineers , 2012.
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abstract = "The reliability of silkscreen printed capacitors and inductors were assessed based on thermal cycling (0-100°C) and humidity bias life (85°C/85{\%}RH) tests. The used fabrication materials were Melinex ST504 polyester as a substrate, Asahi LS-411AW silver paste as a conductor and Asahi CR-18□-KT1 as the dielectric of capacitors and crossover insulator of inductors. Several components' geometries, with and without encapsulation, were studied to find out the influence of size and encapsulation effect on long term reliability. The results show, that thermal cycling induced stresses are not critical for the technology considered. The capacitance increased approximately 20{\%} during the first 3000 cycles, while inductance kept quite constant (±3{\%}). However, the inductor loss resistance decreased almost 10-20{\%}. Humidity bias tests showed quite different results. For example, capacitance of all tested capacitor geometries increased more than 60{\%} after approximately 2500h in an 85°C/85{\%}RH environment. The Weibull analysis showed that larger capacitors are more vulnerable to combined temperature and humidity bias than smaller ones. The Weibull parameters obtained for the large (15mm × 15mm) capacitors under 85°C/85{\%}RH were β = 2.8 and η = 1623. The failure criterion was the total failure of the dielectric. Furthermore, under temperature cycling, the corresponding parameters were β = 3.7 and η = 2486. In these, the failure criterion was the 1st electrical indication of the dielectric deterioration, i.e., a clear drop in the DC resistance. None of the encapsulated components failed during the 85°C/85{\%}RH tests, which suggest that simple lamination enhances the component reliability.",
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Voutilainen, JV, Happonen, T & Häkkinen, J 2012, Reliability of silkscreen printed planar capacitors and inductors under accelerated thermal cycling and humidity bias life testing. in 2012 4th Electronic System-Integration Technology Conference, ESTC 2012., 6542201, IEEE Institute of Electrical and Electronic Engineers , 4th Electronic System-Integration Technology Conference, ESTC 2012, Amsterdam, Netherlands, 17/09/12. https://doi.org/10.1109/ESTC.2012.6542201

Reliability of silkscreen printed planar capacitors and inductors under accelerated thermal cycling and humidity bias life testing. / Voutilainen, Juha Veikko; Happonen, Tuomas; Häkkinen, Juha.

2012 4th Electronic System-Integration Technology Conference, ESTC 2012. IEEE Institute of Electrical and Electronic Engineers , 2012. 6542201.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Voutilainen JV, Happonen T, Häkkinen J. Reliability of silkscreen printed planar capacitors and inductors under accelerated thermal cycling and humidity bias life testing. In 2012 4th Electronic System-Integration Technology Conference, ESTC 2012. IEEE Institute of Electrical and Electronic Engineers . 2012. 6542201 https://doi.org/10.1109/ESTC.2012.6542201