Reliability of wafer-level SLID bonds for MEMS encapsulation

Hongbo Xu; Mikael Broas; Hongqun Dong; V. Vuorinen; Tommi Suni; Sami Vähänen; Philippe Monnoyer; Mervi Paulasto-Krockel

Reliability of wafer-level SLID bonds for MEMS encapsulation

Hongbo Xu, Mikael Broas, Hongqun Dong, V. Vuorinen, Tommi Suni, Sami Vähänen, Philippe Monnoyer, Mervi Paulasto-Krockel

CO111 Sales and Customer Partnerships II

Aalto University

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

3 Citations (Scopus)

Abstract

Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melting metallurgy are going to be presented. The MEMS are packaged under vacuum with internal pressure in the range of 1 mbar after sealing. Through Silicon Vias in a silicon interposer allow the feeding of the electrical contacts to the package outside. The thin silicon interposer acts as MEMS carrier or lid and therefore is part of the final packaged component after dicing. AuSn rings have been chosen for process compatibility with the MEMS and ensure the hermeticity of the components after vacuum sealing. Evaluation of the bond process is carried out using XRay imaging microscopy, analysis of cross sections and the final package resistance is evaluated using shear testing. The thickness of the chip-scale packaged MEMS is smaller than 500 ?m and a yield of vacuum sealing of around 80% was obtained in first evaluation on 200 mm wafer scale

Original language	English
Title of host publication	2013 European Microelectronics Packaging Conference (EMPC)
Publisher	IEEE Institute of Electrical and Electronic Engineers
Number of pages	6
ISBN (Print)	978-2-9527-4671-7
Publication status	Published - 2013
MoE publication type	A4 Article in a conference publication
Event	EMPC 2013: European Microelectronics and Packaging Conference - Grenoble, France Duration: 9 Sept 2013 → 12 Sept 2013

Conference

Conference	EMPC 2013
Country/Territory	France
City	Grenoble
Period	9/09/13 → 12/09/13

Keywords

WLP
vacuum
MEMS
interposer
sealing
Au/Sn

Access to Document

https://ieeexplore.ieee.org/document/6698678

Cite this

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title = "Reliability of wafer-level SLID bonds for MEMS encapsulation",

abstract = "Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melting metallurgy are going to be presented. The MEMS are packaged under vacuum with internal pressure in the range of 1 mbar after sealing. Through Silicon Vias in a silicon interposer allow the feeding of the electrical contacts to the package outside. The thin silicon interposer acts as MEMS carrier or lid and therefore is part of the final packaged component after dicing. AuSn rings have been chosen for process compatibility with the MEMS and ensure the hermeticity of the components after vacuum sealing. Evaluation of the bond process is carried out using XRay imaging microscopy, analysis of cross sections and the final package resistance is evaluated using shear testing. The thickness of the chip-scale packaged MEMS is smaller than 500 ?m and a yield of vacuum sealing of around 80% was obtained in first evaluation on 200 mm wafer scale",

keywords = "WLP, vacuum, MEMS, interposer, sealing, Au/Sn",

author = "Hongbo Xu and Mikael Broas and Hongqun Dong and V. Vuorinen and Tommi Suni and Sami V{\"a}h{\"a}nen and Philippe Monnoyer and Mervi Paulasto-Krockel",

note = "Project code: 70851; EMPC 2013 : European Microelectronics and Packaging Conference ; Conference date: 09-09-2013 Through 12-09-2013",

year = "2013",

language = "English",

isbn = "978-2-9527-4671-7",

booktitle = "2013 European Microelectronics Packaging Conference (EMPC)",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

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TY - GEN

T1 - Reliability of wafer-level SLID bonds for MEMS encapsulation

AU - Xu, Hongbo

AU - Broas, Mikael

AU - Dong, Hongqun

AU - Vuorinen, V.

AU - Suni, Tommi

AU - Vähänen, Sami

AU - Monnoyer, Philippe

AU - Paulasto-Krockel, Mervi

N1 - Project code: 70851

PY - 2013

Y1 - 2013

N2 - Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melting metallurgy are going to be presented. The MEMS are packaged under vacuum with internal pressure in the range of 1 mbar after sealing. Through Silicon Vias in a silicon interposer allow the feeding of the electrical contacts to the package outside. The thin silicon interposer acts as MEMS carrier or lid and therefore is part of the final packaged component after dicing. AuSn rings have been chosen for process compatibility with the MEMS and ensure the hermeticity of the components after vacuum sealing. Evaluation of the bond process is carried out using XRay imaging microscopy, analysis of cross sections and the final package resistance is evaluated using shear testing. The thickness of the chip-scale packaged MEMS is smaller than 500 ?m and a yield of vacuum sealing of around 80% was obtained in first evaluation on 200 mm wafer scale

AB - Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melting metallurgy are going to be presented. The MEMS are packaged under vacuum with internal pressure in the range of 1 mbar after sealing. Through Silicon Vias in a silicon interposer allow the feeding of the electrical contacts to the package outside. The thin silicon interposer acts as MEMS carrier or lid and therefore is part of the final packaged component after dicing. AuSn rings have been chosen for process compatibility with the MEMS and ensure the hermeticity of the components after vacuum sealing. Evaluation of the bond process is carried out using XRay imaging microscopy, analysis of cross sections and the final package resistance is evaluated using shear testing. The thickness of the chip-scale packaged MEMS is smaller than 500 ?m and a yield of vacuum sealing of around 80% was obtained in first evaluation on 200 mm wafer scale

KW - WLP

KW - vacuum

KW - MEMS

KW - interposer

KW - sealing

KW - Au/Sn

M3 - Conference article in proceedings

SN - 978-2-9527-4671-7

BT - 2013 European Microelectronics Packaging Conference (EMPC)

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - EMPC 2013

Y2 - 9 September 2013 through 12 September 2013

ER -

Reliability of wafer-level SLID bonds for MEMS encapsulation

Abstract

Conference

Keywords

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