Reliability of wafer-level SLID bonds for MEMS encapsulation

Hongbo Xu, Mikael Broas, Hongqun Dong, V. Vuorinen, Tommi Suni, Sami Vähänen, Philippe Monnoyer, Mervi Paulasto-Krockel

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

3 Citations (Scopus)

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Physics & Astronomy