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Replacing solder with isotropically conductive adhesives in die bonding of power semiconductors

  • Outi Rusanen
  • VTT (former employee or external)

Research output: Chapter in Book/Report/Conference proceedingChapter or book articleProfessional

Original languageEnglish
Title of host publicationConductive Adhesives for Electronics Packaging
EditorsJohan Liu
Place of PublicationIsle of Man
Publication statusPublished - 2000
MoE publication typeD2 Article in professional manuals or guides or professional information systems or text book material

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