Reverse-Offset Printing of Metal-Nitrate-Based Metal Oxide Semiconductor Ink for Flexible TFTs

Jaakko Leppäniemi (Corresponding Author), Asko Sneck, Yasuyuki Kusaka, Nobuko Fukuda, Ari Alastalo

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)

Abstract

Reverse-offset printing (ROP) is a novel printing technique capable of forming electronics-industry-relevant linewidths (≈1 µm) with good thickness control and sharp edge definition. It is demonstrated that through a controlled oxygen-plasma treatment, the energy of the surfaces related to the process steps of ROP can be optimized to allow the patterning of metal-oxide semiconductor layers using a simple printing ink based on metal nitrates dissolved in an organic solvent. The steps of the ROP process are analyzed using surface-energy measurements and Fourier transform infrared spectra of the ink during drying. Thin-film transistors (TFTs) fabricated using a roll-to-plate ROP of In2O3 semiconductor and evaporated Al source/drain (S/D) contacts show, on average, mobilities of 3.1 and 3.5 cm2 V−1 s−1, and ON/OFF-ratios up to 108 and 107 on a Si/SiO2 substrate and on a flexible polyimide-type substrate, respectively. TFTs on the flexible substrate with also the S/D-contacts printed with ROP using Ag nanoparticle ink exhibit a 1.4 cm2 V−1 s−1 mobility. To demonstrate the scalability of the process, continuous lines of In2O3 are printed using a roll-to-roll-compatible (R2R) ROP with linewidths down to ≈2 µm. This process is expected to lead to miniaturized metal-oxide circuits as required by flexible high-resolution sensor arrays and displays.

Original languageEnglish
Article number1900272
JournalAdvanced Electronic Materials
Volume5
Issue number8
DOIs
Publication statusPublished - 2019
MoE publication typeA1 Journal article-refereed

Fingerprint

Offset printing
Thin film transistors
Ink
Nitrates
Metals
Linewidth
Substrates
Thickness control
Electric power measurement
Electronics industry
Surface measurement
Sensor arrays
Interfacial energy
Polyimides
Organic solvents
Oxides
Oxide semiconductors
Scalability
Printing
Drying

Keywords

  • flexible electronics
  • metal oxides
  • printed transistors
  • reverse offset printing

Cite this

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abstract = "Reverse-offset printing (ROP) is a novel printing technique capable of forming electronics-industry-relevant linewidths (≈1 µm) with good thickness control and sharp edge definition. It is demonstrated that through a controlled oxygen-plasma treatment, the energy of the surfaces related to the process steps of ROP can be optimized to allow the patterning of metal-oxide semiconductor layers using a simple printing ink based on metal nitrates dissolved in an organic solvent. The steps of the ROP process are analyzed using surface-energy measurements and Fourier transform infrared spectra of the ink during drying. Thin-film transistors (TFTs) fabricated using a roll-to-plate ROP of In2O3 semiconductor and evaporated Al source/drain (S/D) contacts show, on average, mobilities of 3.1 and 3.5 cm2 V−1 s−1, and ON/OFF-ratios up to 108 and 107 on a Si/SiO2 substrate and on a flexible polyimide-type substrate, respectively. TFTs on the flexible substrate with also the S/D-contacts printed with ROP using Ag nanoparticle ink exhibit a 1.4 cm2 V−1 s−1 mobility. To demonstrate the scalability of the process, continuous lines of In2O3 are printed using a roll-to-roll-compatible (R2R) ROP with linewidths down to ≈2 µm. This process is expected to lead to miniaturized metal-oxide circuits as required by flexible high-resolution sensor arrays and displays.",
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Reverse-Offset Printing of Metal-Nitrate-Based Metal Oxide Semiconductor Ink for Flexible TFTs. / Leppäniemi, Jaakko (Corresponding Author); Sneck, Asko; Kusaka, Yasuyuki; Fukuda, Nobuko; Alastalo, Ari.

In: Advanced Electronic Materials, Vol. 5, No. 8, 1900272, 2019.

Research output: Contribution to journalArticleScientificpeer-review

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