Reverse Offset Printing of Semidried Metal Acetylacetonate Layers and Its Application to a Solution-Processed IGZO TFT Fabrication

Yasuyuki Kusaka (Corresponding Author), Naoki Shirakawa, Shintaro Ogura, Jaakko Leppäniemi, Asko Sneck, Ari Alastalo, Hirobumi Ushijima, Nobuko Fukuda

Research output: Contribution to journalArticleScientificpeer-review

8 Citations (Scopus)


The submicrometer resolution printing of various metal acetylacetonate complex inks including Fe, V, Mn, Co, Ni, Zn, Zr, Mo, and In was enabled by a robust ink formulation scheme which adopted a ternary solvent system where solubility, surface wettability, and drying as well as absorption behavior on a polydimethylsiloxane sheet were optimized. Hydrogen plasma in heated conditions resulted in bombarded, resistive, or conductive state depending on the temperature and the metal species. With a conductivity-bestowed layer of MoOx and a plasma-protecting layer of ZrOx situated on the top of an IGZO layer, a solution-processed TFT exhibiting an average mobility of 0.17 cm2/(V s) is demonstrated.

Original languageEnglish
Pages (from-to)24339-24343
Number of pages5
JournalACS Applied Materials & Interfaces
Issue number29
Publication statusPublished - 25 Jul 2018
MoE publication typeNot Eligible



  • hydrogen plasma
  • metal complex
  • metal oxide
  • Printing
  • solution process
  • transistor

Cite this