Abstract
In this paper, some practical aspects of reworking flip chip hybridized
pixel detectors are discussed. As flip chip technology has been
advancing in terms of placement accuracy and reliability, large-area
hybrid pixel detectors have been developed. The area requirements are
usually fulfilled by placing several readout chips (ROCs) on single
sensor chip. However, as the number of ROCs increases, the probability
of failure in the hybridization process and the ROC operation also
increases. Because high accuracy flip chip bonding takes time, a
significant part of the price of a pixel detector comes from the flip
chip assembly process itself. As large-area detector substrates are
expensive, and many flip chip placements are required, the price of an
assembled detector can become very high. In a typical case, there is
just one bad ROC (out of several) on a faulty detector to be replaced.
Considering the high price of pixel detectors and the fact that
reworking faulty ROCs does not take much longer than the original
placement, it is worthwhile to investigate the feasibility of a rework
process.
Original language | English |
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Pages (from-to) | 233 - 236 |
Number of pages | 4 |
Journal | Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment |
Volume | 591 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2008 |
MoE publication type | A1 Journal article-refereed |
Keywords
- flip chip
- solder pumps
- rework
- radiation detectors: pixel detectors