Rework of flip chip bonded radiation pixel detectors

Engineering

• Large Area 100%
• Reliability 50%
• Sensor Chip 50%
• Chip Bonding 50%
• Take Time 50%
• Practical Aspect 50%
• Assembly Process 50%
• Hybrid 50%
• Failure (Mechanical) 50%
• Requirements 50%
• Substrates 50%
• Radiation 50%
• High Accuracy 50%
• High Price 50%

Physics

• Reliability 50%
• Area 50%
• Substrates 50%
• Probability Theory 50%
• Failure 50%

Computer Science

• Chip Technology 50%
• Probability 50%