Rework of flip chip bonded radiation pixel detectors

Engineering

• Assembly Process 50%
• Chip Bonding 50%
• Failure (Mechanical) 50%
• High Accuracy 50%
• High Price 50%
• Hybrid 50%
• Large Area 100%
• Practical Aspect 50%
• Radiation 100%
• Reliability 50%
• Requirements 50%
• Sensor Chip 50%
• Substrates 50%
• Take Time 50%

Physics

• Area 100%
• Failure 33%
• Probability Theory 33%
• Reliability 33%
• Substrates 33%
• Technology 33%

Computer Science

• Accuracy 100%
• Chip Technology 50%
• Probability 50%
• Sensor 50%