RF-model extraction for passive components on MCM-Si materials

Hannu Ronkainen, Tarja Riihisaari, Hannu Kattelus

Research output: Contribution to journalArticleScientificpeer-review

Abstract

Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.
Original languageEnglish
Pages (from-to)279-282
Number of pages4
JournalPhysica Scripta
VolumeT79
DOIs
Publication statusPublished - 1999
MoE publication typeA1 Journal article-refereed

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Equivalent Circuit
polychlorinated biphenyls
packing density
equivalent circuits
Packing
thick films
Silicon
Chip
modules
chips
Substrate
ceramics
Module
silicon
Modeling
Model

Cite this

Ronkainen, Hannu ; Riihisaari, Tarja ; Kattelus, Hannu. / RF-model extraction for passive components on MCM-Si materials. In: Physica Scripta. 1999 ; Vol. T79. pp. 279-282.
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abstract = "Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.",
author = "Hannu Ronkainen and Tarja Riihisaari and Hannu Kattelus",
year = "1999",
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language = "English",
volume = "T79",
pages = "279--282",
journal = "Physica Scripta",
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RF-model extraction for passive components on MCM-Si materials. / Ronkainen, Hannu; Riihisaari, Tarja; Kattelus, Hannu.

In: Physica Scripta, Vol. T79, 1999, p. 279-282.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - RF-model extraction for passive components on MCM-Si materials

AU - Ronkainen, Hannu

AU - Riihisaari, Tarja

AU - Kattelus, Hannu

PY - 1999

Y1 - 1999

N2 - Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.

AB - Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.

U2 - 10.1238/Physica.Topical.079a00279

DO - 10.1238/Physica.Topical.079a00279

M3 - Article

VL - T79

SP - 279

EP - 282

JO - Physica Scripta

JF - Physica Scripta

SN - 0031-8949

ER -