Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.
|Number of pages||4|
|Publication status||Published - 1999|
|MoE publication type||A1 Journal article-refereed|