RF-model extraction for passive components on MCM-Si materials

Hannu Ronkainen, Tarja Riihisaari, Hannu Kattelus

    Research output: Contribution to journalArticleScientificpeer-review

    Abstract

    Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.
    Original languageEnglish
    Pages (from-to)279-282
    Number of pages4
    JournalPhysica Scripta
    VolumeT79
    DOIs
    Publication statusPublished - 1999
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Equivalent Circuit
    polychlorinated biphenyls
    packing density
    equivalent circuits
    Packing
    thick films
    Silicon
    Chip
    modules
    chips
    Substrate
    ceramics
    Module
    silicon
    Modeling
    Model

    Cite this

    Ronkainen, Hannu ; Riihisaari, Tarja ; Kattelus, Hannu. / RF-model extraction for passive components on MCM-Si materials. In: Physica Scripta. 1999 ; Vol. T79. pp. 279-282.
    @article{5047df9bd5c6473e88b2081a83a05d44,
    title = "RF-model extraction for passive components on MCM-Si materials",
    abstract = "Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.",
    author = "Hannu Ronkainen and Tarja Riihisaari and Hannu Kattelus",
    year = "1999",
    doi = "10.1238/Physica.Topical.079a00279",
    language = "English",
    volume = "T79",
    pages = "279--282",
    journal = "Physica Scripta",
    issn = "0031-8949",
    publisher = "Institute of Physics IOP",

    }

    RF-model extraction for passive components on MCM-Si materials. / Ronkainen, Hannu; Riihisaari, Tarja; Kattelus, Hannu.

    In: Physica Scripta, Vol. T79, 1999, p. 279-282.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

    T1 - RF-model extraction for passive components on MCM-Si materials

    AU - Ronkainen, Hannu

    AU - Riihisaari, Tarja

    AU - Kattelus, Hannu

    PY - 1999

    Y1 - 1999

    N2 - Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.

    AB - Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.

    U2 - 10.1238/Physica.Topical.079a00279

    DO - 10.1238/Physica.Topical.079a00279

    M3 - Article

    VL - T79

    SP - 279

    EP - 282

    JO - Physica Scripta

    JF - Physica Scripta

    SN - 0031-8949

    ER -