RF-model extraction for passive components on MCM-Si materials

Hannu Ronkainen, Tarja Riihisaari, Hannu Kattelus

    Research output: Contribution to journalArticleScientificpeer-review

    Abstract

    Silicon based Multi Chip Module (MCM-Si) technology offers high precision and high packing density compared with traditional PCB and ceramic thick film hybrid technologies. When used in RF-equipment, MCM-Si's suffer from severe signal loading and signal coupling via the substrate. In this paper modeling of passive elements on MCM's is discussed. Simple equivalent circuits and parameter extraction methods are presented.
    Original languageEnglish
    Pages (from-to)279-282
    Number of pages4
    JournalPhysica Scripta
    VolumeT79
    DOIs
    Publication statusPublished - 1999
    MoE publication typeA1 Journal article-refereed

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