Abstract
The present invention relates to a solution for treating a surface of a substrate for use in a semiconductor device. More particularly, the present invention relates to a liquid rinse formulation for use in semiconductor processing, wherein the liquid formulation contains: i. a surface passivation agent; and ii. an oxygen scavenger, wherein the pH of the rinse formulation is 8.0 or greater.
| Original language | English |
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| Patent number | US20100273330A1 |
| IPC | PCT/B06/03051 |
| Filing date | 23/08/06 |
| Publication status | Published - 28 Oct 2010 |
| MoE publication type | H1 Granted patent |