Abstract
To improve the potential application opportunities of roll-to-roll flexible printed electronics, improved system integration and area reduction of hybrid systems is possible using two-sided functional carrier foils. These double-sided circuits, and systems, on flexible substrates can have multiple functional layers, such as conductive or semiconductive materials, on both sides. This study aimed to increase the density and complexity of the hybrid systems, while reducing the material and processing costs. The focus was on three main tasks: roll-to-roll (R2R) via laser cutting and filling, R2R etching of two-sided indium tin oxide (ITO)/polyethylene terephthalate (PET), and a double-sided ITO system backplane for organic photovoltaic (OPV) integration. Critical parameters for choice of Ag layer thickness, interconnection pitch and additional via filling need to be considered in the system design phase to improve manufacturing efficiency.
| Original language | English |
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| Title of host publication | 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Number of pages | 3 |
| ISBN (Electronic) | 979-8-3503-8326-3 |
| ISBN (Print) | 979-8-3503-8327-0 |
| DOIs | |
| Publication status | Published - 2024 |
| MoE publication type | A4 Article in a conference publication |
| Event | 6th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2024 - Tampere, Finland Duration: 30 Jun 2024 → 3 Jul 2024 |
Publication series
| Series | IEEE International Conference on Flexible and Printable Sensors and Systems |
|---|---|
| Volume | 2024 |
| ISSN | 2832-8248 |
Conference
| Conference | 6th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2024 |
|---|---|
| Country/Territory | Finland |
| City | Tampere |
| Period | 30/06/24 → 3/07/24 |
Funding
This research was co-funded by the Research Council of Finland (RCF), Printed intelligence infrastructure funding, decision 358621 and the RCF Flagship Programme, Photonics Research and Innovation (PREIN), Dnro 346545. Also, by CETPartnership (REFORM, CETP-2022-00348), the European Partnership under Joint Call 2022 co-funded by the European Commission (GA N 101069750) and with funding by Business Finland, Dnro 2876/31/2023. Support also received by SUSTRONICS project supported by the Chips Joint Undertaking and its members under the cofounded European Union grant agreement 1021112109 and Business Finland Dnro 7926/31/2022.
Keywords
- energy module
- flexible electronics
- hybrid systems
- printed electronics
- PV
- R2R